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SN74LS327NP1

Texas Instruments

SN74LS327NP1 by Texas Instruments

SN74LS327NP1 by Texas Instruments is a TTL technology oscillator with 14 terminals and a 5V supply voltage. It operates b/w 0°C to 70°C, housed in a plastic/epoxy package for through-hole mounting. Ideal for applications requiring precise timing functions in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,322 parts In-Stock

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Digiode

USA . 4,611 parts In-Stock

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4,611

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,555 parts In-Stock

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$1.010

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1,555

$1.010

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Parana Technologies

USA . 1,105 parts In-Stock

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$1.405

100+ parts

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$2.110

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1,105

$1.405

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$2.110

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ChromeModa Solutions

Germany . 1,988 parts In-Stock

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$1.579

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$1.295

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1,988

$1.579

$1.295

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

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$1.579

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$1.421

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1,938

$1.579

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$1.421

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Semicontronic

India . 1,541 parts In-Stock

1+ parts

$3.010

100+ parts

$2.935

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$2.920

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1,541

$3.010

$2.935

$2.920

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One Stop Electronics

USA . 1,061 parts In-Stock

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$3.010

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1,061

$3.010

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AZTECH Wire

Italy . 665 parts In-Stock

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$17.149

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665

$17.149

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DigiPath Technology Company

USA . 1,345 parts In-Stock

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$1.424

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1,345

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$1.424

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Corohmni

South Africa . 288 parts In-Stock

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288

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Corphita

USA . 195 parts In-Stock

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Overview

Discover the ultimate solution for your oscillator needs with the SN74LS327NP1 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers unmatched performance in the category of Other Function Oscillators. This versatile product offers customers a range of applications, ensuring seamless integration into various electronic systems. With a nominal supply voltage of 5V and through-hole mounting feature, the SN74LS327NP1 provides unparalleled value, benefits, and advantages that will elevate your projects to new heights. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides good protection for the internal components of the oscillator, ensuring durability and reliability.

Technology: TTL

TTL technology ensures high speed and reliable performance, making this oscillator suitable for applications requiring fast signal processing.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, making this oscillator compatible with a wide range of devices.

Power Supplies (V): 5

The 5V power supply ensures consistent and stable operation of the oscillator, reducing the risk of voltage fluctuations affecting performance.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and integration with other components in a circuit, increasing the flexibility of use.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this oscillator can withstand higher temperatures in industrial or harsh environments without compromising functionality.

Minimum Operating Temperature: 0 °C

The ability to operate in temperatures as low as 0°C ensures reliable performance even in cold conditions, making this oscillator suitable for a wide range of applications.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mount design simplifies the installation process and provides a secure and stable connection, reducing the risk of disconnection or damage during operation.

Technical Specifications

Other Function Oscillators SN74LS327NP1 attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIP14,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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