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SN74LS325N

Texas Instruments

SN74LS325N by Texas Instruments

SN74LS325N by Texas Instruments is a TTL technology oscillator with 16 terminals and a 5V supply voltage. It operates b/w 0-70°C, housed in a plastic/epoxy package for through-hole mounting. Ideal for applications requiring precise timing and signal generation in various electronic circuits.

Median Price

$2.347

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 25 parts In-Stock

1+ parts

$2.347

100+ parts

$2.464

1k+ parts

$2.324

10k+ parts

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25

$2.347

$2.464

$2.324

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Vyrian

USA . 6,048 parts In-Stock

1+ parts

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6,048

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Digiode

USA . 268 parts In-Stock

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268

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GES GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,129 parts In-Stock

1+ parts

$0.286

100+ parts

-

1k+ parts

$1.540

10k+ parts

-

2,129

$0.286

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$1.540

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DigiPath Technology Company

USA . 1,726 parts In-Stock

1+ parts

$0.315

100+ parts

$0.289

1k+ parts

-

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1,726

$0.315

$0.289

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ChromeModa Solutions

Germany . 4,389 parts In-Stock

1+ parts

$0.321

100+ parts

$0.263

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4,389

$0.321

$0.263

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IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$0.321

100+ parts

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1k+ parts

$0.289

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808

$0.321

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$0.289

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One Stop Electronics

USA . 629 parts In-Stock

1+ parts

$2.010

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629

$2.010

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AZTECH Wire

Italy . 793 parts In-Stock

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$14.966

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793

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Corphita

USA . 2,603 parts In-Stock

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Assy Fe

Spain . 125 parts In-Stock

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125

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Overview

Elevate your electronic projects with the SN74LS325N by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers once again with this versatile product. Whether you're working on a robotics project or designing a new electronic device, this TTL technology-based oscillator is sure to meet your needs. With a 5V supply voltage and 16 terminals, this product offers flexibility and convenience. Trust Texas Instruments to provide the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity and reliability.

Technology: TTL

TTL technology offers high speed and reliability, making the product ideal for applications where timing and precision are crucial.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V makes the product compatible with a wide range of systems and circuits, simplifying integration.

Power Supplies (V): 5

Consistent power supply of 5V ensures stable performance and prevents damage to the product, enhancing its overall efficiency.

No. of Terminals: 16

With 16 terminals, the product allows for versatile connectivity options and compatibility with a variety of setups, increasing its utility.

Maximum Operating Temperature: 70 °C

The product can operate effectively in high-temperature environments, ensuring reliable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

The product can also function in low-temperature settings, making it suitable for a wide range of applications in different climates or environments.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature facilitates secure and stable installation, ensuring the product remains firmly in place during operation.

Technical Specifications

Other Function Oscillators SN74LS325N attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIP16,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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