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SN74LS324NP1

Texas Instruments

SN74LS324NP1 by Texas Instruments

SN74LS324NP1 by Texas Instruments is a TTL technology oscillator with 14 terminals and a 5V supply voltage. It operates b/w 0°C to 70°C, featuring a plastic/epoxy body suitable for through-hole mounting. Ideal for applications requiring precise timing functions in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,913 parts In-Stock

1+ parts

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5,913

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Digiode

USA . 3,501 parts In-Stock

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3,501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 149 parts In-Stock

1+ parts

$1.010

100+ parts

$0.985

1k+ parts

$0.980

10k+ parts

-

149

$1.010

$0.985

$0.980

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One Stop Electronics

USA . 1,188 parts In-Stock

1+ parts

$2.010

100+ parts

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1,188

$2.010

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Ampacity Inc.

Singapore . 1,102 parts In-Stock

1+ parts

$2.010

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1,102

$2.010

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Parana Technologies

USA . 193 parts In-Stock

1+ parts

$2.578

100+ parts

-

1k+ parts

$3.070

10k+ parts

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193

$2.578

-

$3.070

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ChromeModa Solutions

Germany . 5,607 parts In-Stock

1+ parts

$2.897

100+ parts

$2.376

1k+ parts

-

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5,607

$2.897

$2.376

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$2.897

100+ parts

-

1k+ parts

$2.607

10k+ parts

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1,816

$2.897

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$2.607

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AZTECH Wire

Italy . 834 parts In-Stock

1+ parts

$13.505

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834

$13.505

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DigiPath Technology Company

USA . 2,199 parts In-Stock

1+ parts

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$2.612

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2,199

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$2.612

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Corphita

USA . 958 parts In-Stock

1+ parts

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958

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Corohmni

South Africa . 179 parts In-Stock

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179

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Overview

Unlock a world of possibilities with the SN74LS324NP1 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has crafted this versatile product to meet your needs in a variety of applications. Whether you're looking to enhance your electronic projects or streamline your industrial processes, this TTL technology-based device offers unmatched value, benefits, and advantages. Say goodbye to limitations and hello to endless possibilities with the SN74LS324NP1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, providing good protection for the internal components.

Technology: TTL

TTL technology ensures high-speed operation and low power consumption, making the product efficient and suitable for various applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easier.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the oscillator to other components, allowing for customization and versatility in circuit design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C indicates that the product can withstand harsh environmental conditions, ensuring reliability and longevity.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the oscillator remains functional even in cold environments, making it suitable for various applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process, making it easier for users to integrate the oscillator into their circuits securely.

Technical Specifications

Other Function Oscillators SN74LS324NP1 attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIP14,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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