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SN74LS123JP4

Texas Instruments

SN74LS123JP4 by Texas Instruments

SN74LS123JP4 by Texas Instruments is a TTL technology Prescaler & Multivibrator with 16 terminals. It operates at 5V, with a temperature range of 0-70°C. The package is ceramic, rectangular in shape, and through-hole terminal form. Ideal for commercial applications requiring precise timing functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,205 parts In-Stock

1+ parts

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6,205

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Digiode

USA . 4,987 parts In-Stock

1+ parts

-

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4,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$10.752

100+ parts

-

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873

$10.752

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Parana Technologies

USA . 2,154 parts In-Stock

1+ parts

$27.902

100+ parts

-

1k+ parts

$41.462

10k+ parts

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2,154

$27.902

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$41.462

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DigiPath Technology Company

USA . 2,372 parts In-Stock

1+ parts

$30.724

100+ parts

$28.266

1k+ parts

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10k+ parts

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2,372

$30.724

$28.266

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ChromeModa Solutions

Germany . 6,163 parts In-Stock

1+ parts

$31.351

100+ parts

$25.708

1k+ parts

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6,163

$31.351

$25.708

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IDEA Electronic Components Group

UK . 157 parts In-Stock

1+ parts

$31.351

100+ parts

$29.783

1k+ parts

$28.216

10k+ parts

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157

$31.351

$29.783

$28.216

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One Stop Electronics

USA . 856 parts In-Stock

1+ parts

$32.000

100+ parts

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856

$32.000

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Corphita

USA . 2,287 parts In-Stock

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2,287

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Overview

Unlock the power of precision with the SN74LS123JP4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality prescaler & multivibrators that are designed to exceed expectations. Whether you're working on a complex project or simple application, this product offers unmatched reliability and performance. With a nominal supply voltage of 5V and a durable ceramic package, the SN74LS123JP4 is built to last. Trust Texas Instruments to provide cutting-edge technology that meets your needs every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides better thermal conductivity and heat dissipation, leading to improved reliability and performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and arrangement on circuit boards, optimizing space usage.

Nominal Supply Voltage / Vsup (V): 5

Operates on a commonly available supply voltage, making it compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

Can withstand relatively high temperatures, ensuring stable operation in various environmental conditions.

Technology: TTL

Uses Transistor-Transistor logic which provides fast switching speeds and low power consumption, ideal for digital applications.

Technical Specifications

Prescaler & Multivibrators SN74LS123JP4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Prescaler/Multivibrators

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS123JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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