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CD74HCT221MTG4

Texas Instruments

CD74HCT221MTG4 by Texas Instruments

CD74HCT221MTG4 by Texas Instruments is a Prescaler & Multivibrator with 2 functions, operating at 5V. It has a propagation delay of 63ns and operates in temperatures ranging from -55 to 125°C. This CMOS technology device is ideal for military-grade applications requiring precise timing and complementary output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,855 parts In-Stock

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Digiode

USA . 3,335 parts In-Stock

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3,335

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Parana Technologies

USA . 313 parts In-Stock

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$9.365

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$9.987

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313

$9.365

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$9.987

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ChromeModa Solutions

Germany . 3,708 parts In-Stock

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$10.522

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$8.628

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$10.522

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IDEA Electronic Components Group

UK . 556 parts In-Stock

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$10.522

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$9.996

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$9.470

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556

$10.522

$9.996

$9.470

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AZTECH Wire

Italy . 702 parts In-Stock

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$14.368

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702

$14.368

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Ampacity Inc.

Singapore . 926 parts In-Stock

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$37.000

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926

$37.000

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One Stop Electronics

USA . 702 parts In-Stock

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$57.000

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702

$57.000

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DigiPath Technology Company

USA . 2,305 parts In-Stock

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$9.487

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$9.487

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

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Overview

Discover the innovative CD74HCT221MTG4 by Texas Instruments, a top-tier manufacturer known for producing high-quality components. This prescaler & multivibrator offers unparalleled reliability and performance in a compact design, perfect for a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 63ns, this product ensures fast and efficient operation. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CD74HCT221MTG4, delivering superior results for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic systems and applications.

Propagation Delay (tpd): 63 ns

The low propagation delay ensures fast and efficient signal processing, making this product ideal for high-speed applications.

Temperature Grade: MILITARY

Designed to meet rigorous military standards for temperature tolerance and reliability, ensuring optimal performance in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable in noise-sensitive applications.

Technical Specifications

Prescaler & Multivibrators CD74HCT221MTG4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

NON-RETRIGGERABLE

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

63 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT221MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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