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SN74HC4066DRE4

Texas Instruments

SN74HC4066DRE4 by Texas Instruments

SN74HC4066DRE4 by Texas Instruments is a CMOS SPST switch with 4 functions, operating at -40 to 85°C. It has a max on-state resistance of 85 ohm and nominal bandwidth of 30 kHz. Ideal for industrial applications requiring separate outputs and make-before-break switching.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,119 parts In-Stock

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Digiode

USA . 1,636 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Ampacity Inc.

Singapore . 371 parts In-Stock

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$1.500

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$1.500

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One Stop Electronics

USA . 567 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 420 parts In-Stock

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$6.955

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Parana Technologies

USA . 926 parts In-Stock

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$17.405

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$17.608

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926

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$17.608

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ChromeModa Solutions

Germany . 4,799 parts In-Stock

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$19.556

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$16.036

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IDEA Electronic Components Group

UK . 664 parts In-Stock

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$19.556

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$18.578

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$17.600

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Corohmni

South Africa . 843 parts In-Stock

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Corphita

USA . 4,854 parts In-Stock

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Continental Prestige Electronics

USA . 4,269 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 2,511 parts In-Stock

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Argo Parts USA

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DigiPath Technology Company

USA . 523 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock endless possibilities with the SN74HC4066DRE4 by Texas Instruments. Crafted with precision and reliability, this multiplexer & switch offers seamless functionality across a diverse range of applications. From consumer electronics to industrial automation, this product delivers unparalleled performance and efficiency. Experience peace of mind knowing that you're investing in a quality solution that guarantees optimal results every time. Elevate your projects with the SN74HC4066DRE4 and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer, ensuring a longer product lifespan.

Surface Mount: YES

Being surface mountable makes the multiplexer easier to integrate into electronic circuits, saving space and simplifying the assembly process.

No. of Functions: 4

With 4 functions in one device, this multiplexer offers versatility and efficiency in switching between different inputs or outputs, making it suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V provides a stable power source for the multiplexer to operate efficiently within its specified parameters.

Power Supplies (V): 2/6

The multiplexer can support power supplies ranging from 2V to 6V, offering flexibility in voltage requirements for different applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold ensures good conductivity and corrosion resistance, maintaining reliable connections for optimal performance.

Output (V): SEPARATE OUTPUT

Having separate outputs allows for independent control and processing of signals, offering more flexibility in signal routing and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer energy-efficient and reliable in various operating conditions.

Nominal Bandwidth: 30 kHz

With a nominal bandwidth of 30 kHz, this multiplexer can handle high-frequency signals effectively, making it suitable for applications that require fast switching speeds.

Technical Specifications

Multiplexers & Switches SN74HC4066DRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

30 kHz

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

42 dB

Maximum On-state Resistance (Ron):

85 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

40 ns

Maximum Switch-on Time:

36 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.905 mm

Trade Compliance

SN74HC4066DRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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