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SN74HC123JP4

Texas Instruments

SN74HC123JP4 by Texas Instruments

SN74HC123JP4 by Texas Instruments is a CMOS Prescaler & Multivibrator with 16 terminals. It operates b/w -40°C to 85°C, suitable for industrial applications. The package is made of ceramic, in-line style, and supports power supplies from 2V to 6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,946 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,946

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Vyrian

USA . 1,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,520 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,520

$7.000

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$19.389

100+ parts

-

1k+ parts

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414

$19.389

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Parana Technologies

USA . 819 parts In-Stock

1+ parts

$28.796

100+ parts

-

1k+ parts

$51.922

10k+ parts

-

819

$28.796

-

$51.922

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$31.708

100+ parts

$29.171

1k+ parts

-

10k+ parts

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1,895

$31.708

$29.171

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IDEA Electronic Components Group

UK . 1,536 parts In-Stock

1+ parts

$32.355

100+ parts

$30.737

1k+ parts

$29.120

10k+ parts

-

1,536

$32.355

$30.737

$29.120

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ChromeModa Solutions

Germany . 1,344 parts In-Stock

1+ parts

$32.355

100+ parts

$26.531

1k+ parts

-

10k+ parts

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1,344

$32.355

$26.531

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Corphita

USA . 3,974 parts In-Stock

1+ parts

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3,974

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Overview

Unlock the power of precision with the Texas Instruments SN74HC123JP4. Crafted with top-quality materials and cutting-edge technology, this prescaler and multivibrator delivers unmatched performance in a compact rectangular package. From industrial automation to telecommunications, this versatile component caters to a wide range of applications with ease. Experience seamless operation, reliable functionality, and exceptional durability with the SN74HC123JP4. Elevate your projects and achieve outstanding results with this high-grade solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and high temperature stability, making it suitable for industrial applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy incorporation into circuit designs and PCB layouts.

Power Supplies (V): 2/6

Wide range of power supply voltage options allows for flexibility in different operating environments.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and devices in a circuit.

Package Style (Meter): IN-LINE

In-line package style saves space and facilitates easy mounting on a circuit board.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures ruggedness and durability for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical connections and allows for easy soldering onto a PCB.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy integration into existing circuit designs and PCB layouts.

Technical Specifications

Prescaler & Multivibrators SN74HC123JP4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC123JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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