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SN74AHC4066DBRG4

Texas Instruments

SN74AHC4066DBRG4 by Texas Instruments

SN74AHC4066DBRG4 by Texas Instruments is a CMOS SPST switch with 4 channels, 225 ohm Ron, and 40 dB isolation. It operates at -40 to 85 °C and has a bandwidth of 50 kHz. Ideal for industrial applications requiring fast switching and low on-state resistance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,740 parts In-Stock

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4,740

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Digiode

USA . 2,489 parts In-Stock

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2,489

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Distributors (Availability)

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Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

$2.318

100+ parts

-

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$2.815

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1,356

$2.318

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$2.815

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DigiPath Technology Company

USA . 1,938 parts In-Stock

1+ parts

$2.552

100+ parts

$2.348

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1,938

$2.552

$2.348

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ChromeModa Solutions

Germany . 2,229 parts In-Stock

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$2.604

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$2.135

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$2.135

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IDEA Electronic Components Group

UK . 1,723 parts In-Stock

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$2.604

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$2.344

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1,723

$2.604

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$2.344

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Semicontronic

India . 1,497 parts In-Stock

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$4.500

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$4.388

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$4.365

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1,497

$4.500

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$4.365

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One Stop Electronics

USA . 570 parts In-Stock

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$4.500

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570

$4.500

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AZTECH Wire

Italy . 741 parts In-Stock

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$8.868

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741

$8.868

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Component Stockers USA

USA . 612 parts In-Stock

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$99.990

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612

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Microchip USA

USA . 3,448 parts In-Stock

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Corphita

USA . 2,817 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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Overview

Unlock a world of possibilities with the Texas Instruments SN74AHC4066DBRG4 multiplexer and switch. Expertly crafted with high-quality materials and cutting-edge technology, this versatile component offers unrivaled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers seamless operation and exceptional value to customers seeking superior functionality and efficiency. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring longevity and ease of handling.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving space and time during assembly.

No. of Functions: 4

Provides the capability to handle multiple functions within a single device, reducing the need for additional components.

Nominal Supply Voltage (Vsup): 2.3 V

Suitable voltage for efficient operation and compatibility with various circuits.

Power Supplies (V): 2.5/5

Versatile power supply options for different applications and voltage requirements.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows usage in diverse conditions without compromising functionality.

Technology: CMOS

Uses CMOS technology known for low power consumption, making it energy-efficient and cost-effective.

Nominal Bandwidth: 50 kHz

Provides sufficient bandwidth for signal transmission, ensuring smooth operation and data throughput.

Technical Specifications

Multiplexers & Switches SN74AHC4066DBRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

50 kHz

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

6 ohm

Maximum On-state Resistance (Ron):

225 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.02 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

25 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

SN74AHC4066DBRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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