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SN74145NSRE4

Texas Instruments

SN74145NSRE4 by Texas Instruments

SN74145NSRE4 by Texas Instruments is a TTL decoder with 16 terminals and open-collector outputs. It operates at a supply voltage of 5V, with a propagation delay of 50ns. This small outline package is ideal for applications requiring standard input conditioning and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,150 parts In-Stock

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6,150

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Digiode

USA . 916 parts In-Stock

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916

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$12.297

100+ parts

-

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581

$12.297

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Parana Technologies

USA . 1,450 parts In-Stock

1+ parts

$21.407

100+ parts

-

1k+ parts

$21.754

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1,450

$21.407

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$21.754

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ChromeModa Solutions

Germany . 4,294 parts In-Stock

1+ parts

$24.053

100+ parts

$19.723

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4,294

$24.053

$19.723

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

1+ parts

$24.053

100+ parts

$22.850

1k+ parts

$21.648

10k+ parts

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1,687

$24.053

$22.850

$21.648

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One Stop Electronics

USA . 1,307 parts In-Stock

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$56.000

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1,307

$56.000

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Microchip USA

USA . 7,320 parts In-Stock

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7,320

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Corphita

USA . 668 parts In-Stock

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668

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DigiPath Technology Company

USA . 335 parts In-Stock

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$21.686

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335

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$21.686

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Overview

Upgrade your electronic projects with the reliable SN74145NSRE4 by Texas Instruments, a leading manufacturer in the industry. This versatile decoder & driver offers seamless integration and exceptional performance for various applications. With its high-quality construction and innovative technology, this product ensures efficiency and accuracy in your designs. Experience the value and benefits of this compact yet powerful component, providing you with the competitive edge you need. Trust Texas Instruments for top-of-the-line solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making the decoder & driver versatile in application.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in many electronic systems, providing a stable power source for the decoder & driver.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with external components, expanding the functionality of the decoder & driver.

Technology: TTL

Utilizing TTL technology ensures fast and reliable signal processing, making the decoder & driver a high-performance choice.

Technical Specifications

Decoder & Drivers SN74145NSRE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ION MAX=80MA @ VOL MAX=3V

Family:

TTL/H/L

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74145NSRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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