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SN65MLVD205DRG4

Texas Instruments

SN65MLVD205DRG4 by Texas Instruments

SN65MLVD205DRG4 by Texas Instruments is a CMOS Line Transceiver with 14 terminals. It operates at 3.3V, has a max supply current of 26mA, and supports EIA-899; TIA-899 interface standard. Ideal for industrial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,426 parts In-Stock

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6,426

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Digiode

USA . 227 parts In-Stock

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227

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,751 parts In-Stock

1+ parts

$2.249

100+ parts

-

1k+ parts

$2.751

10k+ parts

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1,751

$2.249

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$2.751

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ChromeModa Solutions

Germany . 6,698 parts In-Stock

1+ parts

$2.527

100+ parts

$2.072

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6,698

$2.527

$2.072

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

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$2.527

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$2.274

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1,151

$2.527

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$2.274

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AZTECH Wire

Italy . 693 parts In-Stock

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$9.938

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693

$9.938

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One Stop Electronics

USA . 1,269 parts In-Stock

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$12.500

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1,269

$12.500

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Corphita

USA . 3,931 parts In-Stock

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3,931

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Microchip USA

USA . 306 parts In-Stock

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DigiPath Technology Company

USA . 147 parts In-Stock

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$2.278

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147

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$2.278

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Overview

Unleash the power of seamless communication with the SN65MLVD205DRG4 by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and reliability. Whether in industrial automation or automotive applications, this product delivers exceptional performance, ensuring smooth data transmission. With a compact design and advanced technology, the SN65MLVD205DRG4 is the perfect solution for your connectivity needs. Trust Texas Instruments to provide you with cutting-edge solutions that bring value and efficiency to your projects. Elevate your systems with the unmatched benefits and advantages of the SN65MLVD205DRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Being surface mountable makes the product easy to handle and install, saving space on the PCB.

Maximum Supply Voltage: 3.6 V

Support for a high supply voltage range allows for flexibility in power source selection.

Maximum Transmit Delay: 4.1 ns

Low transmit delay ensures fast and efficient data transfer, crucial for high-speed applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the product suitable for use in harsh environmental conditions.

Maximum Output Low Current: 8 Amp

High output current capability allows for driving strong signals over long distances without degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Interface Standard: EIA-899; TIA-899

Compliance with industry standards ensures compatibility with a wide range of communication systems.

Maximum Supply Current: 26 mA

Low supply current requirement helps in reducing power consumption, making the product energy-efficient.

Technical Specifications

Line Drivers & Receivers SN65MLVD205DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6.7 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

4.1 ns

Width:

3.9 mm

Trade Compliance

SN65MLVD205DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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