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SN65MLVD205DR

Texas Instruments

SN65MLVD205DR by Texas Instruments

SN65MLVD205DR by Texas Instruments is a CMOS Line Transceiver with 14 terminals. It operates at 3.3V, has a max supply current of 26mA, and supports EIA-899; TIA-899 interface standard. Ideal for industrial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,608 parts In-Stock

1+ parts

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5,608

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Digiode

USA . 3,902 parts In-Stock

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3,902

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Distributors (Availability)

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Parana Technologies

USA . 1,790 parts In-Stock

1+ parts

$4.539

100+ parts

-

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$4.985

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1,790

$4.539

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$4.985

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DigiPath Technology Company

USA . 1,901 parts In-Stock

1+ parts

$4.998

100+ parts

$4.598

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1,901

$4.998

$4.598

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

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$5.100

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$4.590

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1,451

$5.100

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$4.590

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ChromeModa Solutions

Germany . 808 parts In-Stock

1+ parts

$5.100

100+ parts

$4.182

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808

$5.100

$4.182

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One Stop Electronics

USA . 1,525 parts In-Stock

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$8.500

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1,525

$8.500

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AZTECH Wire

Italy . 538 parts In-Stock

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$14.809

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538

$14.809

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Component Stockers USA

USA . 320 parts In-Stock

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$99.990

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320

$99.990

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A-Z Elektronik GmbH

Germany . 4,779 parts In-Stock

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Corphita

USA . 4,320 parts In-Stock

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Microchip USA

USA . 477 parts In-Stock

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Overview

Upgrade your communication systems with the SN65MLVD205DR by Texas Instruments, a top-of-the-line Line Driver & Receiver designed to deliver unparalleled performance and reliability. With a reputation for excellence, Texas Instruments ensures that this product meets the highest quality standards, making it ideal for a wide range of applications. Experience seamless data transmission and enhanced signal integrity with this cutting-edge solution. Trust in Texas Instruments to provide you with the best-in-class technology, delivering value and benefits that will exceed your expectations. Elevate your systems with the SN65MLVD205DR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, ensuring the product will last a long time in various operating conditions.

Surface Mount: YES

Easily mountable on PCBs, saving space and making installation more convenient.

Maximum Supply Voltage: 3.6 V

Can handle relatively high voltage levels, providing flexibility in power supply options.

Maximum Transmit Delay: 4.1 ns

Offers fast communication speeds, ideal for applications requiring quick data transmission.

Power Supplies (V): 3.3

Operates efficiently with a standard voltage supply, making it compatible with common power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a factor.

Technical Specifications

Line Drivers & Receivers SN65MLVD205DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6.7 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

4.1 ns

Width:

3.9 mm

Trade Compliance

SN65MLVD205DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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