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SN65MLVD204ADRG4

Texas Instruments

SN65MLVD204ADRG4 by Texas Instruments

SN65MLVD204ADRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 3.5ns max transmit delay, and 85°C max operating temp. Ideal for industrial applications requiring differential output and EIA-899/TIA-899 interface standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 17,670 parts In-Stock

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Vyrian

USA . 7,156 parts In-Stock

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Digiode

USA . 3,093 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Parana Technologies

USA . 2,349 parts In-Stock

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$6.314

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$7.063

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2,349

$6.314

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$7.063

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DigiPath Technology Company

USA . 882 parts In-Stock

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$6.952

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882

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ChromeModa Solutions

Germany . 2,832 parts In-Stock

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$7.094

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$5.817

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

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$7.094

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$6.385

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Corohmni

South Africa . 212 parts In-Stock

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$8.489

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AZTECH Wire

Italy . 307 parts In-Stock

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$9.692

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Semicontronic

India . 333 parts In-Stock

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$11.500

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$11.212

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$11.155

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Ampacity Inc.

Singapore . 1,158 parts In-Stock

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$13.500

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One Stop Electronics

USA . 1,139 parts In-Stock

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$28.500

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Kepictronics

USA . 13,200 parts In-Stock

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Corphita

USA . 4,645 parts In-Stock

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Argo Parts USA

USA . 4,430 parts In-Stock

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Microchip USA

USA . 2,389 parts In-Stock

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Continental Prestige Electronics

USA . 2,194 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your communication systems with the SN65MLVD204ADRG4 by Texas Instruments, a top-of-the-line Line Driver & Receiver that guarantees reliability and superior performance. Crafted by a trusted manufacturer in the industry, this product offers seamless integration, high-speed data transmission, and excellent signal quality for various applications. Experience the value of quick transmit delay, low power consumption, and industrial-grade temperature range, making it the perfect solution for your connectivity needs. Upgrade to Texas Instruments and elevate your communication game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while also keeping the product lightweight.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a variety of power sources.

Maximum Transmit Delay: 3.5 ns

Enables fast data transmission.

Output Characteristics: DIFFERENTIAL

Provides reliable signal transmission and noise rejection.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperatures.

Interface Standard: EIA-899; TIA-899

Compliant with industry standards for seamless integration with other devices.

Technical Specifications

Line Drivers & Receivers SN65MLVD204ADRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.01 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

3.899 mm

Trade Compliance

SN65MLVD204ADRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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