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SN65MLVD202DG4

Texas Instruments

SN65MLVD202DG4 by Texas Instruments

SN65MLVD202DG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 4.1ns max transmit delay, and 85°C max operating temp. Ideal for industrial applications requiring differential output and EIA-899/TIA-899 interface standard compliance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,916 parts In-Stock

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Digiode

USA . 698 parts In-Stock

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698

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Distributors (Availability)

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Parana Technologies

USA . 1,973 parts In-Stock

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$4.667

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$5.149

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$5.149

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DigiPath Technology Company

USA . 1,076 parts In-Stock

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$5.139

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$4.728

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ChromeModa Solutions

Germany . 4,985 parts In-Stock

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$5.244

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$4.300

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

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$5.244

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$4.720

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AZTECH Wire

Italy . 191 parts In-Stock

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$7.246

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One Stop Electronics

USA . 343 parts In-Stock

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$46.500

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Corphita

USA . 2,470 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Enhance your communication systems with the SN65MLVD202DG4 by Texas Instruments. As a leading manufacturer in line drivers & receivers, Texas Instruments delivers top-quality products for a wide range of applications. This small outline package offers differential output, complementary polarity, and Schmitt trigger input characteristics, ensuring reliable and efficient performance for industrial-grade operations. With a maximum operating temperature of 85°C and a low output current of 8 Amp, this line transceiver provides unmatched value and benefits to customers seeking high-quality communication solutions. Upgrade your systems today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

This feature allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB.

Maximum Transmit Delay: 4.1 ns

The low transmit delay ensures fast signal transmission, suitable for high-speed applications.

Power Supplies (V): 3.3

The standard power supply voltage makes integration into existing systems easier.

No. of Terminals: 14

Sufficient terminals provide connectivity options for various systems.

Maximum High Level Input Current: 0.00001 Amp

Low input current ensures energy efficiency and minimizes heat dissipation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environments.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides balanced signal transmission.

Technical Specifications

Line Drivers & Receivers SN65MLVD202DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6.7 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4.1 ns

Width:

3.9 mm

Trade Compliance

SN65MLVD202DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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