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SN65LVDT9637BDG4

Texas Instruments

SN65LVDT9637BDG4 by Texas Instruments

SN65LVDT9637BDG4 by Texas Instruments is a Line Receiver IC with 2 functions, operating at 3.3V. It features EIA-644/TIA-644 interface standard, differential Schmitt trigger input characteristics, and 6ns max receive delay. Ideal for industrial applications requiring high-speed data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,192 parts In-Stock

1+ parts

-

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1k+ parts

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5,192

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Digiode

USA . 4,616 parts In-Stock

1+ parts

-

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4,616

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,839 parts In-Stock

1+ parts

$10.190

100+ parts

-

1k+ parts

$10.727

10k+ parts

-

1,839

$10.190

-

$10.727

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$11.221

100+ parts

$10.323

1k+ parts

-

10k+ parts

-

1,203

$11.221

$10.323

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ChromeModa Solutions

Germany . 2,679 parts In-Stock

1+ parts

$11.450

100+ parts

$9.389

1k+ parts

-

10k+ parts

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2,679

$11.450

$9.389

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IDEA Electronic Components Group

UK . 764 parts In-Stock

1+ parts

$11.450

100+ parts

$10.878

1k+ parts

$10.305

10k+ parts

-

764

$11.450

$10.878

$10.305

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$13.339

100+ parts

-

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10k+ parts

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738

$13.339

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One Stop Electronics

USA . 1,252 parts In-Stock

1+ parts

$45.500

100+ parts

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1,252

$45.500

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Corphita

USA . 3,586 parts In-Stock

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3,586

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Microchip USA

USA . 1,167 parts In-Stock

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1,167

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Overview

Elevate your electronic designs with the SN65LVDT9637BDG4 by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This line driver and receiver offers unmatched performance for various applications, providing customers with enhanced functionality and seamless operation. With its durable plastic body material, compact design, and advanced features, this product ensures optimal signal transmission and efficiency. Trust Texas Instruments to deliver cutting-edge technology that brings value and benefits to your projects. Upgrade to the SN65LVDT9637BDG4 today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Functions: 2

Having multiple functions enhances the versatility and capability of the product, making it suitable for complex applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the product into existing electronic designs and configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature conditions.

Interface Standard: EIA-644; TIA-644

Compliance with industry interface standards ensures compatibility and seamless integration with other electronic components and systems.

Technical Specifications

Line Drivers & Receivers SN65LVDT9637BDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

.01 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN65LVDT9637BDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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