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SN65LVDT101DGKR

Texas Instruments

SN65LVDT101DGKR by Texas Instruments

SN65LVDT101DGKR by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 0.9ns max transmit delay, and 61mA max supply current. Ideal for industrial applications requiring EIA-644-A/TIA-644-A interface standard compliance and differential output with Schmitt trigger input characteristics.

Median Price

$3.170

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 592 parts In-Stock

1+ parts

$0.544

100+ parts

$0.518

1k+ parts

$0.501

10k+ parts

-

592

$0.544

$0.518

$0.501

-

Chip1Stop

Japan . 723 parts In-Stock

1+ parts

$3.170

100+ parts

-

1k+ parts

-

10k+ parts

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723

$3.170

-

-

-

Texas Instruments

USA . 29,950 parts In-Stock

1+ parts

$3.911

100+ parts

$3.427

1k+ parts

$1.936

10k+ parts

-

29,950

$3.911

$3.427

$1.936

-

Mouser Electronics

USA . 371 parts In-Stock

1+ parts

$7.290

100+ parts

$4.390

1k+ parts

$3.150

10k+ parts

$3.010

371

$7.290

$4.390

$3.150

$3.010

Verical

USA . 592 parts In-Stock

1+ parts

-

100+ parts

$0.518

1k+ parts

$0.501

10k+ parts

-

592

-

$0.518

$0.501

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,786 parts In-Stock

1+ parts

$1.937

100+ parts

-

1k+ parts

-

10k+ parts

-

1,786

$1.937

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.855

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2.855

-

-

-

Vyrian

USA . 5,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,575

-

-

-

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Semtec, LLC

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,365 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

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6,365

$0.550

-

-

-

Corphita

USA . 1,970 parts In-Stock

1+ parts

$1.835

100+ parts

-

1k+ parts

-

10k+ parts

-

1,970

$1.835

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.855

100+ parts

$2.798

1k+ parts

-

10k+ parts

-

2,000

$2.855

$2.798

-

-

Parana Technologies

USA . 1,576 parts In-Stock

1+ parts

$6.615

100+ parts

-

1k+ parts

$7.344

10k+ parts

-

1,576

$6.615

-

$7.344

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DigiPath Technology Company

USA . 1,854 parts In-Stock

1+ parts

$7.284

100+ parts

-

1k+ parts

-

10k+ parts

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1,854

$7.284

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-

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ChromeModa Solutions

Germany . 3,869 parts In-Stock

1+ parts

$7.433

100+ parts

$6.095

1k+ parts

-

10k+ parts

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3,869

$7.433

$6.095

-

-

IDEA Electronic Components Group

UK . 395 parts In-Stock

1+ parts

$7.433

100+ parts

-

1k+ parts

$6.690

10k+ parts

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395

$7.433

-

$6.690

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Kepictronics

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,328

-

-

-

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Overview

Experience seamless data transmission with the Texas Instruments SN65LVDT101DGKR line driver & receiver. Crafted with precision and reliability in mind, this high-quality product boasts a range of applications in various industries. From industrial automation to telecommunications, this small outline package offers exceptional value by delivering fast transmit and receive delays, ensuring optimal performance. Trust Texas Instruments for cutting-edge technology that meets your needs efficiently and effectively. Elevate your projects with the SN65LVDT101DGKR and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy and space-efficient installation on printed circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of operating voltages for flexibility in different applications.

Maximum Transmit Delay: 0.9 ns

Ensures fast and efficient data transmission.

Power Supplies (V): 3.3

Works efficiently with a standard power supply voltage.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without issues.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without malfunctioning.

Technology: BIPOLAR

Utilizes bipolar technology for reliable and efficient signal processing.

Technical Specifications

Line Drivers & Receivers SN65LVDT101DGKR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.9 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

61 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.9 ns

Width:

3 mm

Trade Compliance

SN65LVDT101DGKR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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