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SN65LVDT100DGKG4

Texas Instruments

SN65LVDT100DGKG4 by Texas Instruments

SN65LVDT100DGKG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 0.8ns max transmit delay, and 3.3V power supplies. Ideal for industrial applications requiring differential output and EIA-644-A interface standard compliance in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,162 parts In-Stock

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Digiode

USA . 977 parts In-Stock

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977

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Parana Technologies

USA . 1,596 parts In-Stock

1+ parts

$4.149

100+ parts

$385.314

1k+ parts

$3.734

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1,596

$4.149

$385.314

$3.734

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DigiPath Technology Company

USA . 1,850 parts In-Stock

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$4.569

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$4.203

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1,850

$4.569

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ChromeModa Solutions

Germany . 3,465 parts In-Stock

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$4.662

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$3.823

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$4.662

$3.823

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IDEA Electronic Components Group

UK . 416 parts In-Stock

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$4.662

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$4.196

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416

$4.662

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$4.196

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AZTECH Wire

Italy . 354 parts In-Stock

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$6.730

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354

$6.730

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Ampacity Inc.

Singapore . 468 parts In-Stock

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$7.500

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One Stop Electronics

USA . 1,429 parts In-Stock

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$45.500

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Microchip USA

USA . 1,920 parts In-Stock

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Corphita

USA . 1,699 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance your industrial applications with the high-quality SN65LVDT100DGKG4 line driver & receiver by Texas Instruments. With a durable plastic/epoxy body and advanced technology, this small outline, thin profile device offers differential output and complementary polarity for precise data transmission. Benefit from its dual-terminal position, fast transmit/receive delay of 0.8ns, and wide operating temperature range (-40°C to 85°C). Trust Texas Instruments' reputation for excellence in electronic components and optimize your system's performance with the SN65LVDT100DGKG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Ability to handle high voltage levels, providing flexibility in different operating conditions.

Maximum Transmit Delay: 0.8 ns

Quick transmission delay ensures efficient data transmission.

Power Supplies (V): 3.3

Standard power supply voltage for easy integration into existing systems.

Output Characteristics: DIFFERENTIAL

Differential output helps in reducing noise and improving signal integrity.

Interface Standard: EIA-644-A; TIA-644-A

Adherence to industry standards ensures compatibility with other devices.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and reliability.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with wide temperature ranges.

Technical Specifications

Line Drivers & Receivers SN65LVDT100DGKG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.8 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.8 ns

Width:

3 mm

Trade Compliance

SN65LVDT100DGKG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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