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SN65LVDS9637DGKRG4

Texas Instruments

SN65LVDS9637DGKRG4 by Texas Instruments

SN65LVDS9637DGKRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3V. It features a totem-pole output, EIA-644/TIA-644 interface standard, and industrial temperature grade. Ideal for applications requiring high-speed differential signaling in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,535 parts In-Stock

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4,535

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Vyrian

USA . 3,011 parts In-Stock

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Chip Stock

USA . 695 parts In-Stock

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695

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Nova Conductors

Japan . 30 parts In-Stock

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30

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Microfarads

USA . 7 parts In-Stock

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7

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Bristol Electronics

USA . 7 parts In-Stock

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Corohmni

South Africa . 637 parts In-Stock

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$3.981

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637

$3.981

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Parana Technologies

USA . 1,412 parts In-Stock

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$6.656

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$7.367

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$6.656

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$7.367

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DigiPath Technology Company

USA . 2,069 parts In-Stock

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$7.329

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$7.329

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ChromeModa Solutions

Germany . 2,576 parts In-Stock

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$7.479

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$6.133

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$7.479

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IDEA Electronic Components Group

UK . 308 parts In-Stock

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$7.479

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$6.731

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One Stop Electronics

USA . 1,258 parts In-Stock

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$10.500

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AZTECH Wire

Italy . 513 parts In-Stock

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Semicontronic

India . 1,165 parts In-Stock

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$22.500

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$21.938

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$21.825

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Ampacity Inc.

Singapore . 326 parts In-Stock

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$42.500

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Component Stockers USA

USA . 320 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 6,649 parts In-Stock

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Argo Parts USA

USA . 4,094 parts In-Stock

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Microchip USA

USA . 2,917 parts In-Stock

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Corphita

USA . 916 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Elevate your electronic designs with the SN65LVDS9637DGKRG4 by Texas Instruments, a top-of-the-line Line Driver & Receiver that offers superior quality and reliability. Manufactured by industry leader Texas Instruments, this product guarantees optimal performance and durability. With a wide range of applications in various industries, this device provides unparalleled value to customers seeking high-speed data transmission and precise signal integrity. Trust in Texas Instruments for cutting-edge technology that delivers unmatched benefits and advantages to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Can handle a high supply voltage, making it suitable for a wide range of applications.

No. of Functions: 2

Provides multiple functions in a single component, increasing efficiency.

Package Shape: SQUARE

A square package shape is easy to integrate into PCB layouts.

Power Supplies (V): 3.3

Operates at a commonly used power supply voltage.

No. of Terminals: 8

Provides multiple terminals for connection, enhancing flexibility.

Minimum Operating Temperature: -40 °C

Can operate in harsh environmental conditions with low temperatures.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Interface Standard: EIA-644; TIA-644

Compliant with industry standards for seamless communication with other devices.

Technical Specifications

Line Drivers & Receivers SN65LVDS9637DGKRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SN65LVDS9637DGKRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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