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SN65LVDS9637DGKG4

Texas Instruments

SN65LVDS9637DGKG4 by Texas Instruments

SN65LVDS9637DGKG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3V. It features a max supply voltage of 3.6V, output polarity TRUE, and interface standard EIA-644; TIA-644. Ideal for industrial applications requiring differential input characteristics and a small outline package style.

Median Price

$3.438

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 358 parts In-Stock

1+ parts

$5.320

100+ parts

$2.150

1k+ parts

$1.790

10k+ parts

-

358

$5.320

$2.150

$1.790

-

Avnet

USA . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.556

10k+ parts

$1.462

215

-

-

$1.556

$1.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,690 parts In-Stock

1+ parts

$3.030

100+ parts

-

1k+ parts

-

10k+ parts

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2,690

$3.030

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-

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Vyrian

USA . 7,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,089

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,515 parts In-Stock

1+ parts

$2.871

100+ parts

-

1k+ parts

-

10k+ parts

-

1,515

$2.871

-

-

-

Parana Technologies

USA . 1,985 parts In-Stock

1+ parts

$7.345

100+ parts

-

1k+ parts

$7.839

10k+ parts

-

1,985

$7.345

-

$7.839

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DigiPath Technology Company

USA . 1,889 parts In-Stock

1+ parts

$8.088

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

$8.088

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-

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IDEA Electronic Components Group

UK . 772 parts In-Stock

1+ parts

$8.253

100+ parts

-

1k+ parts

$7.428

10k+ parts

-

772

$8.253

-

$7.428

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ChromeModa Solutions

Germany . 47 parts In-Stock

1+ parts

$8.253

100+ parts

$6.767

1k+ parts

-

10k+ parts

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47

$8.253

$6.767

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Microchip USA

USA . 2,464 parts In-Stock

1+ parts

-

100+ parts

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2,464

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Overview

Enhance your electronic designs with the SN65LVDS9637DGKG4 by Texas Instruments, a top-quality line driver and receiver that offers unmatched reliability and performance. With Texas Instruments' reputation for excellence in the industry, you can trust that this product will meet all your needs. Ideal for applications requiring precise signal transmission, this compact device delivers exceptional value with its high-speed data transfer capabilities and efficient power consumption. Upgrade your projects today with the SN65LVDS9637DGKG4 and experience the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power requirements.

No. of Functions: 2

Having multiple functions in one component helps streamline circuit design and reduce component count.

Package Shape: SQUARE

Square package shape is space-efficient and promotes better circuit layout and heat dissipation.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common voltage levels.

No. of Terminals: 8

Having 8 terminals provides ample connection points for interfacing with other components or circuits.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme environments, such as industrial settings or automotive applications.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other digital devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable for data transmission.

Technical Specifications

Line Drivers & Receivers SN65LVDS9637DGKG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SN65LVDS9637DGKG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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