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SN65LVDS93AIDGGQ1

Texas Instruments

SN65LVDS93AIDGGQ1 by Texas Instruments

Texas Instruments' SN65LVDS93AIDGGQ1 is an AEC-Q100 compliant LINE DRIVER with NICKEL PALLADIUM GOLD finish. It can withstand 30s at 260°C peak reflow temperature and has MSL of 2. Ideal for automotive applications requiring robust communication interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,080 parts In-Stock

1+ parts

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6,080

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Digiode

USA . 4,201 parts In-Stock

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4,201

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 717 parts In-Stock

1+ parts

$2.364

100+ parts

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717

$2.364

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Parana Technologies

USA . 532 parts In-Stock

1+ parts

$9.984

100+ parts

-

1k+ parts

$10.548

10k+ parts

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532

$9.984

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$10.548

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ChromeModa Solutions

Germany . 6,880 parts In-Stock

1+ parts

$11.218

100+ parts

$9.199

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6,880

$11.218

$9.199

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IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$11.218

100+ parts

$10.657

1k+ parts

$10.096

10k+ parts

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1,111

$11.218

$10.657

$10.096

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$16.284

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641

$16.284

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One Stop Electronics

USA . 1,419 parts In-Stock

1+ parts

$27.500

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1,419

$27.500

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Ampacity Inc.

Singapore . 1,216 parts In-Stock

1+ parts

$47.500

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1,216

$47.500

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Argo Parts USA

USA . 1,741 parts In-Stock

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1,741

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Microchip USA

USA . 1,455 parts In-Stock

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1,455

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Continental Prestige Electronics

USA . 1,112 parts In-Stock

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1,112

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 805 parts In-Stock

1+ parts

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$10.114

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805

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$10.114

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Corphita

USA . 452 parts In-Stock

1+ parts

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452

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Overview

Enhance the performance of your automotive electronics with the SN65LVDS93AIDGGQ1 by Texas Instruments. Designed to meet the highest quality standards, this AEC-Q100 certified Line Driver offers reliable signal transmission for a wide range of applications. With its nickel palladium gold finish and advanced technology, this product ensures superior durability and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that provide value and benefits to customers, making your projects stand out in terms of reliability and performance.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product is designed to meet the rigorous automotive industry standards, ensuring high quality and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, extending the lifespan of the product.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, this product can be quickly and efficiently assembled onto circuit boards, reducing production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering connections, ensuring the product performs consistently under various operating conditions.

Moisture Sensitivity Level (MSL): 2

This low moisture sensitivity level indicates that the product is less prone to moisture-related damage, improving its reliability in humid environments.

Interface IC Type: LINE DRIVER

The line driver interface IC type enables this product to effectively drive signals over long distances, making it suitable for applications requiring robust signal transmission.

Technical Specifications

Line Drivers & Receivers SN65LVDS93AIDGGQ1 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SN65LVDS93AIDGGQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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