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SN65LVDS391DRG4

Texas Instruments

SN65LVDS391DRG4 by Texas Instruments

SN65LVDS391DRG4 by Texas Instruments is a 16-terminal line driver with 3.3V power supply, operating from -40 to 85°C. It features 4 functions, differential output, and EIA-644 interface standard. Ideal for industrial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,086 parts In-Stock

1+ parts

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8,086

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Digiode

USA . 2,220 parts In-Stock

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2,220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 690 parts In-Stock

1+ parts

$2.617

100+ parts

-

1k+ parts

$3.108

10k+ parts

-

690

$2.617

-

$3.108

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IDEA Electronic Components Group

UK . 733 parts In-Stock

1+ parts

$2.941

100+ parts

-

1k+ parts

$2.647

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733

$2.941

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$2.647

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ChromeModa Solutions

Germany . 22 parts In-Stock

1+ parts

$2.941

100+ parts

$2.412

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22

$2.941

$2.412

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AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$12.365

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629

$12.365

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One Stop Electronics

USA . 808 parts In-Stock

1+ parts

$44.500

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808

$44.500

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Corphita

USA . 2,952 parts In-Stock

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2,952

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Microchip USA

USA . 1,068 parts In-Stock

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DigiPath Technology Company

USA . 496 parts In-Stock

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$2.652

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496

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$2.652

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Overview

Enhance your electronic designs with the SN65LVDS391DRG4 by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. As part of the Line Drivers & Receivers category, this product offers unmatched reliability and performance across various applications. With a maximum supply voltage of 3.6V and advanced features like differential output and 3-STATE output characteristics, this small outline package delivers exceptional value to customers seeking precision and efficiency in their projects. Elevate your designs with the SN65LVDS391DRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the line driver & receivers, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power sources, making it versatile and compatible with various systems.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifying circuit design and reducing overall cost.

Maximum Transmit Delay: 2.9 ns

Low transmit delay ensures quick and efficient signal transmission, making this product suitable for high-speed communication applications.

Maximum High Level Input Current: 0.00002 Amp

Low input current requirement minimizes power consumption, making this product energy-efficient and ideal for battery-operated devices.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, providing flexibility in controlling the output signal and facilitating multi-device communication on the same bus.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and suitable for industrial applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making this product suitable for industrial settings.

Peak Reflow Temperature: 260 C

High peak reflow temperature allows for safe and effective soldering process, ensuring secure connections and long-lasting performance.

Technical Specifications

Line Drivers & Receivers SN65LVDS391DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

3.91 mm

Trade Compliance

SN65LVDS391DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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