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SN65LVDS390PWRG4

Texas Instruments

SN65LVDS390PWRG4 by Texas Instruments

SN65LVDS390PWRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 3.3V power supplies, and 85°C max operating temp. Ideal for EIA-644/TIA-644 interface standard applications requiring industrial-grade performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,264 parts In-Stock

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Digiode

USA . 4,148 parts In-Stock

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4,148

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Parana Technologies

USA . 783 parts In-Stock

1+ parts

$6.622

100+ parts

-

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$7.346

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783

$6.622

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$7.346

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DigiPath Technology Company

USA . 2,241 parts In-Stock

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$7.292

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$7.292

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ChromeModa Solutions

Germany . 3,289 parts In-Stock

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$7.441

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$6.102

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$7.441

$6.102

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IDEA Electronic Components Group

UK . 489 parts In-Stock

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$7.441

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$6.697

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489

$7.441

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$6.697

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Ampacity Inc.

Singapore . 364 parts In-Stock

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$14.500

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364

$14.500

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AZTECH Wire

Italy . 303 parts In-Stock

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$17.819

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303

$17.819

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One Stop Electronics

USA . 247 parts In-Stock

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$48.500

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$48.500

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QUARKTWIN TECHNOLOGY LTD

USA . 13,108 parts In-Stock

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Microchip USA

USA . 4,267 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,979 parts In-Stock

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Overview

Unlock the power of reliable signal transmission with the SN65LVDS390PWRG4 by Texas Instruments. Designed with precision and quality in mind, this line driver & receiver offers exceptional performance for a wide range of applications. With a compact design and advanced technology, this product ensures seamless communication and efficient operation. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the SN65LVDS390PWRG4 and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of systems.

No. of Functions: 4

Having 4 functions in one device provides cost and space efficiency in circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on a circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product is suitable for industrial environments where heat resistance is required.

Output Characteristics: TOTEM-POLE

The totem-pole output characteristic ensures strong and reliable signal output.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Line Drivers & Receivers SN65LVDS390PWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN65LVDS390PWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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