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SN65LVDS305ZQE

Texas Instruments

SN65LVDS305ZQE by Texas Instruments

SN65LVDS305ZQE by Texas Instruments is a CMOS line driver with 80 terminals. It operates at temperatures from -40 to 85°C and has a supply voltage range of 1.65V to 1.95V. This IC is ideal for industrial applications requiring differential outputs and standard input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,946 parts In-Stock

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6,946

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Digiode

USA . 322 parts In-Stock

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322

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,749 parts In-Stock

1+ parts

$7.963

100+ parts

-

1k+ parts

$8.537

10k+ parts

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1,749

$7.963

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$8.537

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DigiPath Technology Company

USA . 1,500 parts In-Stock

1+ parts

$8.768

100+ parts

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1,500

$8.768

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ChromeModa Solutions

Germany . 2,664 parts In-Stock

1+ parts

$8.947

100+ parts

$7.337

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2,664

$8.947

$7.337

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IDEA Electronic Components Group

UK . 927 parts In-Stock

1+ parts

$8.947

100+ parts

$8.500

1k+ parts

$8.052

10k+ parts

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927

$8.947

$8.500

$8.052

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$9.092

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832

$9.092

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One Stop Electronics

USA . 1,486 parts In-Stock

1+ parts

$39.500

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1,486

$39.500

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Corphita

USA . 4,215 parts In-Stock

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4,215

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Microchip USA

USA . 238 parts In-Stock

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Overview

Unleash the power of high-quality communication with the SN65LVDS305ZQE by Texas Instruments. Designed to deliver exceptional performance within Line Drivers & Receivers, this product offers unparalleled reliability and efficiency. Ideal for industrial applications, this cutting-edge technology ensures seamless transmission and reception of data. Elevate your projects with the value and benefits that only Texas Instruments can provide. Experience the advantage of superior quality with the SN65LVDS305ZQE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material allows for a lightweight and durable package, making it easy to handle and transport.

Surface Mount: YES

Surface mount capability enables easy integration into compact electronic circuits, saving space and reducing assembly time.

Maximum Supply Voltage: 1.95 V

Suitable for low power applications and compatible with various electronic devices that require a maximum supply voltage of 1.95V.

Package Shape: SQUARE

Square package shape allows for efficient use of space in circuit layouts, enhancing overall system design.

Power Supplies (V): 1.8

Operating at 1.8V nominal supply voltage offers efficiency and compatibility with standard power sources.

No. of Terminals: 80

With a large number of terminals, this product supports complex signal transmission requirements and connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density mounting, ensuring efficient signal routing and minimizing signal interference.

Minimum Supply Voltage: 1.65 V

Operates reliably at low supply voltage levels, providing flexibility and energy efficiency in various applications.

Maximum Operating Temperature: 85 °C

Ability to withstand high operating temperatures ensures performance reliability in challenging environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with a combination of metals offers durability, corrosion resistance, and optimal electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure installation, ensuring stable connections in electronic designs.

Maximum Seated Height: 1 mm

Low seated height allows for a compact overall product design, enabling integration in space-constrained applications.

Width: 5 mm

Slim width enhances versatility in circuit board layouts and system configurations, accommodating various design requirements.

Differential Output: YES

Differential output capability provides noise immunity and signal integrity, enhancing overall performance in communication systems.

Length: 5 mm

Compact length facilitates efficient placement within electronic assemblies, optimizing signal transmission paths.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability in harsh operating environments, suitable for industrial applications.

Maximum Receive Delay: 0 ns

Zero receive delay enables real-time signal processing, essential for high-speed communication and data transmission applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for energy-efficient electronic systems.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring effective signal transmission in various electronic setups.

Maximum Supply Current: 18.8 mA

Low maximum supply current requirement enhances energy efficiency and reduces power consumption in operational scenarios.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of devices and signal sources, simplifying system integration.

Nominal Supply Voltage: 1.8 V

Operating at a standard nominal supply voltage of 1.8V allows for easy integration and compatibility with existing electronic systems.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing enables high-density mounting and precise signal routing, enhancing signal integrity and system performance.

Interface IC Type: LINE DRIVER

Designed as a line driver interface IC, this product offers robust signal amplification and transmission capabilities for reliable data communication.

Technical Specifications

Line Drivers & Receivers SN65LVDS305ZQE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18.8 mA

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

SN65LVDS305ZQE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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