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SN65LVDS179DGKRG4

Texas Instruments

SN65LVDS179DGKRG4 by Texas Instruments

SN65LVDS179DGKRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 2.7ns max transmit delay, and 85°C max operating temp. Ideal for EIA-644/TIA-644 interface standards in industrial applications requiring differential output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 21,999 parts In-Stock

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Vyrian

USA . 4,978 parts In-Stock

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Sensible Micro Corp

USA . 4,264 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,132 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,599 parts In-Stock

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Digiode

USA . 1,405 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Prism Electronics

USA . 9 parts In-Stock

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Corohmni

South Africa . 276 parts In-Stock

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$5.540

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AZTECH Wire

Italy . 210 parts In-Stock

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$8.250

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Parana Technologies

USA . 1,118 parts In-Stock

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$8.509

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$9.164

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$9.370

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$8.620

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ChromeModa Solutions

Germany . 3,112 parts In-Stock

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$9.561

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$7.840

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IDEA Electronic Components Group

UK . 131 parts In-Stock

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$9.561

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$9.083

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$8.605

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$13.892

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$13.197

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Semicontronic

India . 1,273 parts In-Stock

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$14.500

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$14.065

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One Stop Electronics

USA . 1,516 parts In-Stock

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Ampacity Inc.

Singapore . 888 parts In-Stock

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Kepictronics

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Continental Prestige Electronics

USA . 2,780 parts In-Stock

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Corphita

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Microchip USA

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Argo Parts USA

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Perfect Parts

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Overview

Unlock seamless data transmission with the SN65LVDS179DGKRG4 from Texas Instruments. Designed with precision and reliability in mind, this line driver and receiver offers unparalleled performance for a wide range of applications. Simplify your design process and enhance signal integrity with this cutting-edge technology. Trust Texas Instruments to deliver superior quality and innovation, providing you with the value and benefits you need to stay ahead in today's fast-paced market. Elevate your project with the SN65LVDS179DGKRG4 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product compatible with a wide range of systems.

Maximum Transmit Delay: 2.7 ns

The low transmit delay ensures fast and efficient data transmission, making the product ideal for high-speed communication applications.

Output Characteristics: DIFFERENTIAL

Differential outputs help in reducing noise and improving signal integrity, making the product suitable for noise-sensitive environments.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability in extreme conditions, making the product suitable for industrial applications.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards ensures compatibility with a wide range of devices, making the product versatile and easy to integrate.

Technical Specifications

Line Drivers & Receivers SN65LVDS179DGKRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.02 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3 mm

Trade Compliance

SN65LVDS179DGKRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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