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SN65LVDS151DAG4

Texas Instruments

SN65LVDS151DAG4 by Texas Instruments

SN65LVDS151DAG4 by Texas Instruments is a Line Driver & Receiver with 32 terminals, operating at 3.3V. It features a max transmit delay of 5.8ns and totem-pole output characteristics. Ideal for industrial applications requiring EIA-644-A/TIA-644-A interface standards and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,851 parts In-Stock

1+ parts

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6,851

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Digiode

USA . 1,201 parts In-Stock

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1,201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,972 parts In-Stock

1+ parts

$7.707

100+ parts

-

1k+ parts

$8.235

10k+ parts

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1,972

$7.707

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$8.235

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DigiPath Technology Company

USA . 416 parts In-Stock

1+ parts

$8.486

100+ parts

$7.807

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416

$8.486

$7.807

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ChromeModa Solutions

Germany . 4,748 parts In-Stock

1+ parts

$8.659

100+ parts

$7.100

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4,748

$8.659

$7.100

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IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$8.659

100+ parts

$8.226

1k+ parts

$7.793

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1,436

$8.659

$8.226

$7.793

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AZTECH Wire

Italy . 860 parts In-Stock

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$13.476

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860

$13.476

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One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$35.500

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579

$35.500

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Microchip USA

USA . 4,592 parts In-Stock

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Corphita

USA . 2,470 parts In-Stock

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Overview

Unleash the power of high-quality communication with the SN65LVDS151DAG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Line Drivers & Receivers that excel in various applications. Offering reliable performance and unmatched durability, this product ensures seamless data transmission at lightning speeds. Unlock the potential of your projects with the SN65LVDS151DAG4 and experience the value it brings to your work. Elevate your designs with precision and efficiency, thanks to the exceptional benefits and advantages this innovative product provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can safely handle high supply voltages, providing reliability in different operating conditions.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient packing on the circuit board, optimizing space usage.

Maximum Transmit Delay: 5.8 ns

Provides fast signal transmission, crucial for maintaining signal integrity in high-speed applications.

Power Supplies (V): 3.3

Operates efficiently within the standard power supply range, ensuring compatibility with existing systems.

No. of Terminals: 32

Having a high number of terminals allows for versatile connectivity options, making it suitable for complex circuit designs.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, suitable for industrial applications that require operation in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish ensures reliable connections and prevents corrosion, increasing the product's lifespan.

Maximum Output Low Current: 0.02 Amp

Capable of delivering low output currents, ideal for driving sensitive components without risk of damage.

Differential Output: YES

Supports differential signaling, reducing electromagnetic interference and improving signal quality over long distances.

Maximum Supply Current: 65 mA

Consumes low power, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Line Drivers & Receivers SN65LVDS151DAG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644-A; TIA-644-A

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

.02 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

5.8 ns

Width:

6.2 mm

Trade Compliance

SN65LVDS151DAG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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