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SN65LVDS117DGGG4

Texas Instruments

SN65LVDS117DGGG4 by Texas Instruments

SN65LVDS117DGGG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3V. It features a max transmit delay of 4.5ns and operates in industrial temperature range (-40 to 85°C). Ideal for EIA-644/TIA-644 interfaces requiring differential outputs in compact designs.

Median Price

$16.930

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$16.930

100+ parts

$8.710

1k+ parts

-

10k+ parts

-

50

$16.930

$8.710

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 758 parts In-Stock

1+ parts

$11.305

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$11.305

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-

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Vyrian

USA . 8,336 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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8,336

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-

-

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Chip Stock

USA . 7,602 parts In-Stock

1+ parts

-

100+ parts

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7,602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

$7.069

100+ parts

-

1k+ parts

$7.603

10k+ parts

-

1,542

$7.069

-

$7.603

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DigiPath Technology Company

USA . 778 parts In-Stock

1+ parts

$7.784

100+ parts

-

1k+ parts

-

10k+ parts

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778

$7.784

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-

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ChromeModa Solutions

Germany . 4,738 parts In-Stock

1+ parts

$7.943

100+ parts

$6.513

1k+ parts

-

10k+ parts

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4,738

$7.943

$6.513

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$7.943

100+ parts

-

1k+ parts

$7.149

10k+ parts

-

1,500

$7.943

-

$7.149

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Corphita

USA . 758 parts In-Stock

1+ parts

$10.710

100+ parts

-

1k+ parts

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10k+ parts

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758

$10.710

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Microchip USA

USA . 4,506 parts In-Stock

1+ parts

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100+ parts

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4,506

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Overview

Elevate your electronic designs with the SN65LVDS117DGGG4 from Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology and reliability. This line driver/receiver offers unparalleled performance and precision in transmitting data, making it ideal for a wide range of applications. With its innovative design and high-quality materials, this product ensures seamless communication and efficient operation. Trust in Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Experience the difference with the SN65LVDS117DGGG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the components, ensuring reliability and ease of handling.

Surface Mount: YES

Facilitates easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing the flexibility of the product.

No. of Functions: 2

Offers dual functionality in a single component, providing cost-effectiveness and efficient use of space.

Maximum Transmit Delay: 4.5 ns

Enables fast signal transmission, ideal for high-speed communication applications.

Power Supplies (V): 3.3

Operates efficiently at a commonly used supply voltage, ensuring compatibility with existing systems.

No. of Terminals: 64

Provides multiple connection points for enhanced signal routing and connectivity options.

Minimum Operating Temperature: -40 °C

Functions reliably in extreme cold conditions, making it suitable for a wide range of environments.

Maximum Operating Temperature: 85 °C

Maintains performance even in high-temperature settings, enhancing overall reliability.

Technical Specifications

Line Drivers & Receivers SN65LVDS117DGGG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

16

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

.02 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

122 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4.5 ns

Width:

6.1 mm

Trade Compliance

SN65LVDS117DGGG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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