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SN65LVDS108DBTG4

Texas Instruments

SN65LVDS108DBTG4 by Texas Instruments

SN65LVDS108DBTG4 by Texas Instruments is a CMOS line driver with 8 bits, operating at 3.3V. It features EIA-644 and TIA-644 interface standards, differential output, and dual terminal position. Ideal for industrial applications requiring fast transmission speeds with low power consumption.

Median Price

$9.890

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$9.890

100+ parts

$5.350

1k+ parts

$5.070

10k+ parts

-

5

$9.890

$5.350

$5.070

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,234 parts In-Stock

1+ parts

$8.037

100+ parts

-

1k+ parts

-

10k+ parts

-

4,234

$8.037

-

-

-

Vyrian

USA . 7,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,470

-

-

-

-

Connector Distribution Corp

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,642

-

-

-

-

Right Parts Inc.

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,642

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 676 parts In-Stock

1+ parts

$6.455

100+ parts

-

1k+ parts

$7.199

10k+ parts

-

676

$6.455

-

$7.199

-

DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$7.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

$7.108

-

-

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ChromeModa Solutions

Germany . 2,197 parts In-Stock

1+ parts

$7.253

100+ parts

$5.947

1k+ parts

-

10k+ parts

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2,197

$7.253

$5.947

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-

IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$7.253

100+ parts

-

1k+ parts

$6.528

10k+ parts

-

101

$7.253

-

$6.528

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Corphita

USA . 4,199 parts In-Stock

1+ parts

$7.614

100+ parts

-

1k+ parts

-

10k+ parts

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4,199

$7.614

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-

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Component Stockers USA

USA . 6 parts In-Stock

1+ parts

$8.120

100+ parts

-

1k+ parts

-

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6

$8.120

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 19,314 parts In-Stock

1+ parts

-

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19,314

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Microchip USA

USA . 3,752 parts In-Stock

1+ parts

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3,752

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Overview

Experience superior quality and reliability with the SN65LVDS108DBTG4 by Texas Instruments, a leading manufacturer in the industry. This Line Driver & Receiver offers unparalleled performance in a variety of applications. With a maximum supply voltage of 3.6V and a compact package design, this product ensures optimal functionality and efficiency. Trust Texas Instruments for cutting-edge technology and innovation. Upgrade your system with the SN65LVDS108DBTG4 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the product.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage levels to ensure stable operation.

Maximum Transmit Delay: 4.5 ns

Offers fast signal transmission for efficient data transfer.

Power Supplies (V): 3.3

Compatible with common power supply voltages for easy integration.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of operating environments.

Nominal Supply Voltage: 3.3 V

Ensures stable power supply for consistent performance.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Line Drivers & Receivers SN65LVDS108DBTG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

8

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

.02 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4.5 ns

Width:

4.4 mm

Trade Compliance

SN65LVDS108DBTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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