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SN65LVDM320DGGG4

Texas Instruments

SN65LVDM320DGGG4 by Texas Instruments

SN65LVDM320DGGG4 by Texas Instruments is an 8-function line transceiver with EIA-644 and TIA-644 interface standards. It operates at a supply voltage range of 3V to 3.6V, has a max transmit delay of 8.7ns, and is ideal for industrial applications requiring differential outputs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,882 parts In-Stock

1+ parts

-

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3,882

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Digiode

USA . 3,678 parts In-Stock

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3,678

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 303 parts In-Stock

1+ parts

$1.500

100+ parts

-

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303

$1.500

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Parana Technologies

USA . 299 parts In-Stock

1+ parts

$8.383

100+ parts

$778.480

1k+ parts

$7.545

10k+ parts

-

299

$8.383

$778.480

$7.545

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DigiPath Technology Company

USA . 1,018 parts In-Stock

1+ parts

$9.231

100+ parts

-

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1,018

$9.231

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ChromeModa Solutions

Germany . 2,514 parts In-Stock

1+ parts

$9.419

100+ parts

$7.724

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-

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2,514

$9.419

$7.724

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

1+ parts

$9.419

100+ parts

$8.948

1k+ parts

$8.477

10k+ parts

-

1,997

$9.419

$8.948

$8.477

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$10.821

100+ parts

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824

$10.821

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Corphita

USA . 1,064 parts In-Stock

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1,064

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Microchip USA

USA . 259 parts In-Stock

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259

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Overview

Enhance your communication systems with the SN65LVDM320DGGG4 by Texas Instruments. This high-quality line driver and receiver offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to telecommunications, this versatile device delivers exceptional value, efficiency, and precision. Trust in Texas Instruments' expertise and experience to provide you with cutting-edge technology that will elevate your projects to the next level. Experience the advantages of the SN65LVDM320DGGG4 today and revolutionize your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components and ensures durability of the product.

Surface Mount: YES

Makes it easy to integrate into electronic circuits without the need for additional mounting hardware.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources and flexibility in design.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space within electronic devices.

Maximum Transmit Delay: 8.7 ns

Ensures fast and efficient data transmission.

No. of Terminals: 64

Provides ample connectivity options for various applications.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of environments, including harsh conditions.

Maximum Seated Height: 1.2 mm

Low profile design allows for installation in compact spaces.

Interface Standard: EIA-644; TIA-644

Complies with industry standards for seamless integration with other components.

Nominal Supply Voltage: 3.3 V

Optimal voltage for efficient performance and power consumption.

Technical Specifications

Line Drivers & Receivers SN65LVDM320DGGG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

8

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G64

Length:

17 mm

No. of Functions:

8

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Receive Delay:

9.8 ns

Receiver No. of Bits:

8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

8.7 ns

Width:

6.1 mm

Trade Compliance

SN65LVDM320DGGG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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