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SN65LBC180RGVT

Texas Instruments

SN65LBC180RGVT by Texas Instruments

SN65LBC180RGVT by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at -40 to 85 °C. It features a max supply voltage of 5.25 V, differential output, and interface standards EIA-485; ISO 8482. Ideal for industrial applications requiring reliable communication over long distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,983 parts In-Stock

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6,983

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 35 parts In-Stock

1+ parts

$8.383

100+ parts

-

1k+ parts

$9.014

10k+ parts

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35

$8.383

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$9.014

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DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

$9.231

100+ parts

-

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1,945

$9.231

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IDEA Electronic Components Group

UK . 1,772 parts In-Stock

1+ parts

$9.419

100+ parts

$8.948

1k+ parts

$8.477

10k+ parts

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1,772

$9.419

$8.948

$8.477

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ChromeModa Solutions

Germany . 614 parts In-Stock

1+ parts

$9.419

100+ parts

$7.724

1k+ parts

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614

$9.419

$7.724

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AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$16.002

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864

$16.002

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One Stop Electronics

USA . 953 parts In-Stock

1+ parts

$30.500

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953

$30.500

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Corphita

USA . 2,937 parts In-Stock

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2,937

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Microchip USA

USA . 292 parts In-Stock

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Overview

Upgrade your communication systems with the SN65LBC180RGVT by Texas Instruments, a top-of-the-line Line Driver & Receiver that guarantees reliable performance and seamless data transmission. Manufactured by industry leader Texas Instruments, this chip carrier boasts a very thin profile and industrial-grade technology for optimal functionality in a wide range of applications. With differential output and EIA-485/ISO 8482 interface standards, this line transceiver ensures high-speed data transfer with minimal power consumption. Invest in the SN65LBC180RGVT today and experience unparalleled quality and efficiency in your communication networks.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the line driver/receiver.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: SQUARE

Square package shape offers stability and ease of mounting on the circuit board.

Maximum Transmit Delay: 18 ns

Low transmit delay ensures quick and efficient data transmission.

Power Supplies (V): 5

Standard power supply voltage for easy integration into existing systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile package style saves space on the PCB and reduces overall system size.

Maximum High Level Input Current: 0.0001 Amp

Low input current ensures energy efficiency and minimizes power consumption.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in extreme cold temperatures.

Terminal Position: QUAD

Quad terminal position allows for easy connections and enhances signal integrity.

Maximum Seated Height: 1 mm

Low seated height enables compact design and efficient PCB layout.

Width: 4 mm

Narrow width contributes to space-saving design and efficient PCB layout.

Maximum Output Low Current: 8 Amp

High output current capability allows for driving power-hungry devices and long-distance communication.

Differential Output: YES

Differential output ensures noise immunity and reliable signal transmission over long distances.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for 30 seconds ensures reliable soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures secure and durable solder joints.

Length: 4 mm

Compact length contributes to space-saving design and efficient PCB layout.

Minimum Out Swing: 1.1 V

Low minimum output swing ensures compatibility with various input devices and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 33 ns

Low receive delay ensures quick reception and processing of incoming data signals.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption.

Terminal Form: NO LEAD

No-lead terminal form simplifies installation and improves reliability.

Interface Standard: EIA-485; ISO 8482

Compliance with industry-standard interface protocols ensures compatibility with a wide range of systems and devices.

Maximum Supply Current: 5 mA

Low supply current ensures energy efficiency and reduces power consumption.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics provide noise immunity and reliable signal detection.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for seamless integration into existing systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for compact design and efficient PCB layout.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the level of protection against moisture-related damage, ensuring long-term reliability.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional communication and signal conversion.

Technical Specifications

Line Drivers & Receivers SN65LBC180RGVT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; ISO 8482

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.1 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

33 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

18 ns

Width:

4 mm

Trade Compliance

SN65LBC180RGVT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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