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SN65LBC171DBRG4

Texas Instruments

SN65LBC171DBRG4 by Texas Instruments

SN65LBC171DBRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 5V. It has a max transmit delay of 12ns and receive delay of 16ns. Ideal for industrial applications requiring EIA-422, TIA-422, EIA-485, TIA-485 interface standards in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,519 parts In-Stock

1+ parts

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6,519

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Digiode

USA . 1,139 parts In-Stock

1+ parts

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 866 parts In-Stock

1+ parts

$2.500

100+ parts

-

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866

$2.500

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Parana Technologies

USA . 1,071 parts In-Stock

1+ parts

$9.461

100+ parts

-

1k+ parts

$10.071

10k+ parts

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1,071

$9.461

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$10.071

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$9.926

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565

$9.926

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DigiPath Technology Company

USA . 1,664 parts In-Stock

1+ parts

$10.417

100+ parts

$9.584

1k+ parts

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10k+ parts

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1,664

$10.417

$9.584

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IDEA Electronic Components Group

UK . 2,094 parts In-Stock

1+ parts

$10.630

100+ parts

$10.098

1k+ parts

$9.567

10k+ parts

-

2,094

$10.630

$10.098

$9.567

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ChromeModa Solutions

Germany . 2,037 parts In-Stock

1+ parts

$10.630

100+ parts

$8.717

1k+ parts

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10k+ parts

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2,037

$10.630

$8.717

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Corphita

USA . 4,006 parts In-Stock

1+ parts

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4,006

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Microchip USA

USA . 420 parts In-Stock

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420

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Overview

Enhance your communication systems with the SN65LBC171DBRG4 by Texas Instruments, a leading manufacturer in the industry. This Line Driver & Receiver offers reliable performance, high-quality construction, and versatile applications. With quick transmit delay, low output current, and differential output, this product ensures seamless data transmission. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your projects. Experience the value and benefits of the SN65LBC171DBRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for a variety of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage capability ensures compatibility with a wide range of systems and power sources.

No. of Functions: 3

Having multiple functions in one device simplifies circuit design and reduces the need for additional components.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V ensures compatibility with common power sources and systems.

No. of Terminals: 20

The high number of terminals allows for versatile connectivity options and flexibility in circuit design.

Maximum High Level Input Current: 0.0001 Amp

The low input current requirement helps in minimizing power consumption and reducing heat generation.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures reliable operation even in scenarios where the power source may fluctuate slightly.

Maximum Operating Temperature: 85 °C

The wide operating temperature range makes the product suitable for use in various environmental conditions and industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliable performance in cold environments or during temperature variations.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connectivity, ensuring reliable data transmission in case of any terminal failure.

Maximum Seated Height: 2 mm

The low seated height makes the product suitable for compact designs and applications where space is limited.

Width: 5.3 mm

The compact width allows for efficient use of board space and facilitates dense circuit layouts.

Maximum Output Low Current: 8 Amp

The high output current capability allows for driving of power-hungry devices or long transmission lines without signal degradation.

Receiver No. of Bits: 3

Having 3 receiver bits ensures accurate data reception and decoding, making the product reliable for data communication applications.

Differential Output: YES

Differential output improves noise immunity and signal integrity, making the product ideal for long-distance communication and noisy environments.

Length: 7.2 mm

The compact length of the product allows for space-efficient integration into circuit designs and compact electronic devices.

Minimum Out Swing: 1 V

The low out swing voltage ensures compatibility and reliable signal transmission in systems with varying voltage levels.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures reliable operation in harsh environments and industrial applications.

Maximum Receive Delay: 16 ns

The low receive delay ensures fast and efficient data reception, making the product suitable for high-speed communication.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed, low power consumption, and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and easy soldering for reliable connectivity in electronic assemblies.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277

Support for multiple interface standards ensures compatibility with a wide range of communication protocols and systems, making the product versatile and interoperable.

Maximum Supply Current: 20 mA

The low supply current requirement helps in minimizing power consumption and heat dissipation, making the product energy-efficient.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics provide hysteresis and noise immunity, ensuring reliable data reception in noisy environments.

Nominal Supply Voltage: 5V

Operating at a standard nominal supply voltage of 5V ensures compatibility with common power sources and systems, simplifying integration.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for compact design and high-density mounting, enabling space-efficient circuit layouts.

Driver No. of Bits: 3

Having 3 driver bits ensures accurate and reliable data transmission, making the product suitable for high-speed communication.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver IC type, the product integrates both line driver and receiver functions, simplifying circuit design and reducing component count.

Technical Specifications

Line Drivers & Receivers SN65LBC171DBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

3

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

SN65LBC171DBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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