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SN65LBC170DWR

Texas Instruments

SN65LBC170DWR by Texas Instruments

SN65LBC170DWR by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at -40 to 85 °C. It features BICMOS technology, EIA-422/TIA-485 interface standards, and a max supply voltage of 5.25 V. Ideal for industrial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,128 parts In-Stock

1+ parts

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4,128

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Vyrian

USA . 3,572 parts In-Stock

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3,572

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,455 parts In-Stock

1+ parts

$6.525

100+ parts

-

1k+ parts

$7.267

10k+ parts

-

1,455

$6.525

-

$7.267

-

ChromeModa Solutions

Germany . 6,115 parts In-Stock

1+ parts

$7.332

100+ parts

$6.012

1k+ parts

-

10k+ parts

-

6,115

$7.332

$6.012

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IDEA Electronic Components Group

UK . 291 parts In-Stock

1+ parts

$7.332

100+ parts

-

1k+ parts

$6.599

10k+ parts

-

291

$7.332

-

$6.599

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$19.171

100+ parts

-

1k+ parts

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10k+ parts

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489

$19.171

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-

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One Stop Electronics

USA . 1,134 parts In-Stock

1+ parts

$37.500

100+ parts

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10k+ parts

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1,134

$37.500

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Kepictronics

USA . 3,850 parts In-Stock

1+ parts

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100+ parts

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3,850

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Corphita

USA . 425 parts In-Stock

1+ parts

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425

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Microchip USA

USA . 182 parts In-Stock

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182

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DigiPath Technology Company

USA . 52 parts In-Stock

1+ parts

-

100+ parts

$6.611

1k+ parts

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10k+ parts

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52

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$6.611

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Overview

Unlock seamless communication with the SN65LBC170DWR by Texas Instruments, a top-tier manufacturer known for innovation and reliability. Designed for Line Drivers & Receivers, this product offers unparalleled quality and performance for various applications. With a focus on efficiency and precision, the SN65LBC170DWR provides value by ensuring smooth data transmission and reliable connectivity. Experience the benefits of this cutting-edge technology and elevate your systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, providing flexibility in various operating conditions.

No. of Functions: 3

Having multiple functions integrated into a single component simplifies design and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and easy placement during assembly.

Maximum Transmit Delay: 12 ns

Low transmit delay ensures fast and reliable signal transmission, crucial for real-time applications.

Power Supplies (V): 5

Standard power supply voltage simplifies compatibility and integration with existing systems.

No. of Terminals: 20

Sufficient number of terminals for connectivity and interfacing with other components or devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs.

Minimum Supply Voltage: 4.75 V

Wide range of supply voltage tolerance ensures stable operation even under varying power conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for use in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable performance in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and allow for different mounting orientations.

Maximum Seated Height: 2.65 mm

Low seated height is beneficial for applications with space constraints or where height is a critical factor.

Width: 7.5 mm

Compact width facilitates tight packing of components on the PCB, optimizing the use of available space.

Maximum Output Low Current: 8 Amp

High output current capability ensures compatibility with a wide range of loads and devices.

Receiver No. of Bits: 3

3-bit receiver allows for precise reception and interpretation of data signals, reducing errors or signal degradation.

Differential Output: YES

Differential output helps improve noise immunity and signal integrity, especially over long cable runs.

Length: 12.8 mm

Optimal length for easy integration and placement on the PCB, without taking up unnecessary space.

Minimum Out Swing: 1 V

Low output swing helps conserve power and minimize signal distortion, maintaining signal quality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in demanding operational environments.

Maximum Receive Delay: 16 ns

Low receive delay ensures quick response for incoming signals, critical for timely data transmission.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connections, improving reliability.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277

Support for multiple interface standards ensures compatibility and interoperability with a wide range of devices and systems.

Maximum Supply Current: 20 mA

Low supply current consumption helps minimize power requirements and heat dissipation, enhancing energy efficiency.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Schmitt trigger input ensures robust noise immunity and signal integrity, especially in noisy environments or high-speed data transmissions.

Nominal Supply Voltage: 5 V

Nominal supply voltage simplifies power management and ensures stable operation within specified voltage limits.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration onto standard PCB layouts and facilitates soldering or connections.

Driver No. of Bits: 3

3-bit driver helps in generating accurate and precise output signals, crucial for high-speed or data-sensitive applications.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type supports bidirectional data transmission, enabling seamless communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers SN65LBC170DWR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

3

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

7.5 mm

Trade Compliance

SN65LBC170DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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