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SN65HVD55DRG4

Texas Instruments

SN65HVD55DRG4 by Texas Instruments

SN65HVD55DRG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 230ns max transmit delay, and 60ns max receive delay. Ideal for EIA-485-A/TIA-485-A interface standard applications in industrial settings due to its BICMOS technology and differential output capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,232 parts In-Stock

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Digiode

USA . 4,876 parts In-Stock

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4,876

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Distributors (Availability)

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One Stop Electronics

USA . 1,325 parts In-Stock

1+ parts

$4.500

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$4.500

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AZTECH Wire

Italy . 814 parts In-Stock

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$5.826

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814

$5.826

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Parana Technologies

USA . 1,661 parts In-Stock

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$11.090

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$11.550

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1,661

$11.090

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DigiPath Technology Company

USA . 999 parts In-Stock

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$12.212

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$11.235

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999

$12.212

$11.235

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ChromeModa Solutions

Germany . 6,718 parts In-Stock

1+ parts

$12.461

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$10.218

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6,718

$12.461

$10.218

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$12.461

100+ parts

$11.838

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$11.215

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1,109

$12.461

$11.838

$11.215

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Component Stockers USA

USA . 232 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,588 parts In-Stock

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Microchip USA

USA . 4,831 parts In-Stock

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Corphita

USA . 3,376 parts In-Stock

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Overview

Unlock seamless communication with the SN65HVD55DRG4 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a leading product in the Line Drivers & Receivers category, this device offers unparalleled value and benefits for a wide range of applications. From industrial automation to automotive systems, the SN65HVD55DRG4 provides efficient data transmission, high-speed performance, and robust protection against noise and interference. Trust Texas Instruments for cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the line driver & receiver, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation and placement on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile and compatible with different systems.

Package Shape: RECTANGULAR

Compact design that saves space and allows for efficient use of PCB real estate.

Maximum Transmit Delay: 230 ns

Provides fast signal transmission, ensuring timely and accurate data communication.

No. of Terminals: 14

Sufficient number of terminals for connecting to other components and devices in a system.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, making it suitable for a variety of applications.

Maximum Output Low Current: 8 Amp

Capable of driving high output current, making it suitable for driving heavy loads.

Output Polarity: TRUE

Provides accurate signal output, ensuring compatibility with other components in the system.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance.

Technical Specifications

Line Drivers & Receivers SN65HVD55DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 1 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.7 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

60 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

230 ns

Width:

3.9 mm

Trade Compliance

SN65HVD55DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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