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SN65HVD34D

Texas Instruments

SN65HVD34D by Texas Instruments

SN65HVD34D by Texas Instruments is a CMOS line transceiver with EIA-422-B, TIA-422-B, EIA-485-A, TIA-485-A, V.11 interface standards. It operates at 3.3V with 14 terminals in a small outline package for industrial use. Features include 65ns max transmit delay and 70ns max receive delay, making it ideal for high-speed communication applications.

Median Price

$5.180

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$5.070

100+ parts

-

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1

$5.070

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DigiKey

USA . 33 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

-

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33

$5.290

-

-

-

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$5.830

100+ parts

$4.580

1k+ parts

$3.630

10k+ parts

$3.440

10

$5.830

$4.580

$3.630

$3.440

Rochester

USA . 32 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.640

32

-

$3.140

$2.810

$2.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,980 parts In-Stock

1+ parts

$2.878

100+ parts

-

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4,980

$2.878

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Vyrian

USA . 1,941 parts In-Stock

1+ parts

-

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1,941

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Chip Stock

USA . 306 parts In-Stock

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306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,151 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

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10k+ parts

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1,151

$2.727

-

-

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Component Stockers USA

USA . 111 parts In-Stock

1+ parts

$5.740

100+ parts

-

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10k+ parts

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111

$5.740

-

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-

Parana Technologies

USA . 268 parts In-Stock

1+ parts

$8.543

100+ parts

-

1k+ parts

$9.202

10k+ parts

-

268

$8.543

-

$9.202

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ChromeModa Solutions

Germany . 3,512 parts In-Stock

1+ parts

$9.599

100+ parts

$7.871

1k+ parts

-

10k+ parts

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3,512

$9.599

$7.871

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IDEA Electronic Components Group

UK . 2,217 parts In-Stock

1+ parts

$9.599

100+ parts

$9.119

1k+ parts

$8.639

10k+ parts

-

2,217

$9.599

$9.119

$8.639

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Lixinc

USA . 8,290 parts In-Stock

1+ parts

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8,290

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DigiPath Technology Company

USA . 1,159 parts In-Stock

1+ parts

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100+ parts

$8.654

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1,159

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$8.654

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Perfect Parts

USA . 485 parts In-Stock

1+ parts

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485

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Overview

Upgrade your communication systems with the SN65HVD34D from Texas Instruments, a trusted leader in innovative technology solutions. This high-quality line driver and receiver offers reliable performance and seamless integration for a wide range of applications. Experience the value of enhanced signal transmission, increased efficiency, and superior reliability with this versatile product. Trust Texas Instruments to deliver cutting-edge solutions that elevate your communication systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a variety of systems and allows for flexibility in power supply options.

Maximum Transmit Delay: 65 ns

The low transmit delay ensures fast signal transmission, making the product ideal for high-speed communication systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for tri-state control, enabling the device to effectively interface with multiple devices on the same bus.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, making it energy-efficient and reliable in various operating conditions.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Support for multiple interface standards ensures compatibility with a wide range of communication protocols, making the product versatile and interoperable.

Technical Specifications

Line Drivers & Receivers SN65HVD34D attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 5MBPS

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

60 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

65 ns

Width:

3.9 mm

Trade Compliance

SN65HVD34D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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