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SN65HVD30MDREPG4

Texas Instruments

SN65HVD30MDREPG4 by Texas Instruments

SN65HVD30MDREPG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 23ns max transmit delay, and 125°C max operating temp. Ideal for EIA-422-B, TIA-422-B, EIA-485-A, TIA-485-A, V.11 interfaces in military-grade applications due to its BICMOS technology and low power consumption of 2.1mA at 3.3V nominal voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,071 parts In-Stock

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Digiode

USA . 4,912 parts In-Stock

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Chip Stock

USA . 4,120 parts In-Stock

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Component Sense

UK . 1,193 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$2.096

100+ parts

$1.991

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$1.991

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600

$2.096

$1.991

$1.991

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

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$4.500

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$4.500

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Parana Technologies

USA . 752 parts In-Stock

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$11.030

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$11.490

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752

$11.030

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$11.490

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DigiPath Technology Company

USA . 1,607 parts In-Stock

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$12.145

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$11.174

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$12.145

$11.174

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IDEA Electronic Components Group

UK . 1,514 parts In-Stock

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$12.393

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$11.773

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$11.154

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$12.393

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ChromeModa Solutions

Germany . 819 parts In-Stock

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$12.393

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$10.162

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819

$12.393

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Corohmni

South Africa . 584 parts In-Stock

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$12.579

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AZTECH Wire

Italy . 280 parts In-Stock

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$17.586

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One Stop Electronics

USA . 1,275 parts In-Stock

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$43.500

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Semicontronic

India . 1,431 parts In-Stock

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$46.500

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$45.338

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$45.105

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QUARKTWIN TECHNOLOGY LTD

USA . 20,054 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Microchip USA

USA . 2,539 parts In-Stock

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A-Z Elektronik GmbH

Germany . 449 parts In-Stock

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Metaverse IC Inc.

Canada . 323 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Modulus Dynamics

Lithuania . 75 parts In-Stock

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GreenTree Electronics

Israel . 30 parts In-Stock

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Overview

Unlock seamless communication with the SN65HVD30MDREPG4 by Texas Instruments. Designed with precision and reliability in mind, this line driver & receiver is perfect for a wide range of applications. With its high-quality construction and advanced technology, this product offers unparalleled value to customers. Experience fast and efficient data transmission, enhanced performance, and superior durability. Trust Texas Instruments to deliver industry-leading solutions that exceed expectations. Elevate your projects with the SN65HVD30MDREPG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuits or PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can handle higher voltages for reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard mounting procedures and layouts.

Maximum Transmit Delay: 23 ns

The low transmit delay of 23ns indicates fast signal transmission, crucial for high-speed communication systems.

Power Supplies (V): 3.3

Operates efficiently at 3.3V, a common voltage level in many electronic devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components and devices in a circuit.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 to 125°C allows the product to function in extreme environmental conditions.

Technology: BICMOS

Utilizing Bipolar-CMOS technology results in improved performance characteristics such as low power consumption and high speed.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Supporting multiple interface standards ensures compatibility with various communication protocols and systems.

Technical Specifications

Line Drivers & Receivers SN65HVD30MDREPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 25MBPS

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

60 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

23 ns

Width:

3.9 mm

Trade Compliance

SN65HVD30MDREPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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