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SN65HVD11SHKJ

Texas Instruments

SN65HVD11SHKJ by Texas Instruments

SN65HVD11SHKJ by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 40ns max transmit delay, and 70ns max receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in military-grade applications requiring differential output and Schmitt trigger input characteristics.

Median Price

$130.875

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 202 parts In-Stock

1+ parts

$127.250

100+ parts

$114.300

1k+ parts

-

10k+ parts

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202

$127.250

$114.300

-

-

Rochester

USA . 1 parts In-Stock

1+ parts

$134.500

100+ parts

$126.430

1k+ parts

$118.360

10k+ parts

-

1

$134.500

$126.430

$118.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$116.680

100+ parts

-

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-

10k+ parts

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50

$116.680

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-

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Digiode

USA . 4,410 parts In-Stock

1+ parts

$120.888

100+ parts

-

1k+ parts

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4,410

$120.888

-

-

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Vyrian

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

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2,293

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

-

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 341 parts In-Stock

1+ parts

$4.058

100+ parts

-

1k+ parts

$4.521

10k+ parts

-

341

$4.058

-

$4.521

-

ChromeModa Solutions

Germany . 3,241 parts In-Stock

1+ parts

$4.559

100+ parts

$3.738

1k+ parts

-

10k+ parts

-

3,241

$4.559

$3.738

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IDEA Electronic Components Group

UK . 602 parts In-Stock

1+ parts

$4.559

100+ parts

-

1k+ parts

$4.103

10k+ parts

-

602

$4.559

-

$4.103

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AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$19.190

100+ parts

-

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10k+ parts

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615

$19.190

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Ampacity Inc.

Singapore . 102 parts In-Stock

1+ parts

$108.160

100+ parts

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102

$108.160

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Corphita

USA . 1,629 parts In-Stock

1+ parts

$114.525

100+ parts

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1,629

$114.525

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DigiPath Technology Company

USA . 2,101 parts In-Stock

1+ parts

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100+ parts

$4.110

1k+ parts

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10k+ parts

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2,101

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$4.110

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Microchip USA

USA . 1,228 parts In-Stock

1+ parts

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1,228

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$114.346

1k+ parts

$110.846

10k+ parts

$108.512

1,000

-

$114.346

$110.846

$108.512

Perfect Parts

USA . 80 parts In-Stock

1+ parts

-

100+ parts

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80

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Overview

Elevate your communication network with the SN65HVD11SHKJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that provide reliable and efficient data transmission. With its ceramic, metal-sealed co-fired body material and advanced technology, this product is perfect for a wide range of applications. Experience seamless connectivity and superior performance with the SN65HVD11SHKJ, offering customers unmatched value and benefits. Trust Texas Instruments to deliver cutting-edge solutions for all your communication needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Provides compatibility with a wide range of supply voltages, increasing flexibility in application.

Maximum Transmit Delay: 40 ns

Ensures fast and efficient data transmission, ideal for high-speed communication systems.

Power Supplies (V): 3.3

Operates efficiently within a common supply voltage range, ensuring compatibility with existing systems.

Minimum Operating Temperature: -55 °C

Can withstand extreme temperatures, making it suitable for industrial and outdoor applications.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry standards ensures interoperability with a wide range of devices and systems.

Technology: BIPOLAR

Provides stable and reliable signal transmission, contributing to overall system performance and reliability.

Technical Specifications

Line Drivers & Receivers SN65HVD11SHKJ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000003 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-CDFP-F8

Length:

7.035 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

210 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL8,.25

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2.21 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

5.75 mm

Trade Compliance

SN65HVD11SHKJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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