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SN65DP159RSBT

Texas Instruments

SN65DP159RSBT by Texas Instruments

Texas Instruments SN65DP159RSBT is a 40-terminal IC with operating temperature range of -40 to 85°C. It features 4 channels, no-lead terminal form, and industrial temperature grade. Suitable for consumer circuits, it has a package style of chip carrier with very thin profile for surface mount applications.

Median Price

$7.672

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,390 parts In-Stock

1+ parts

$6.493

100+ parts

$5.294

1k+ parts

$3.529

10k+ parts

-

1,390

$6.493

$5.294

$3.529

-

DigiKey

USA . 125 parts In-Stock

1+ parts

$8.850

100+ parts

$5.840

1k+ parts

$5.348

10k+ parts

$5.211

125

$8.850

$5.840

$5.348

$5.211

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 30 parts In-Stock

1+ parts

$4.649

100+ parts

-

1k+ parts

-

10k+ parts

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30

$4.649

-

-

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Digiode

USA . 2,747 parts In-Stock

1+ parts

$6.168

100+ parts

-

1k+ parts

-

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2,747

$6.168

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-

-

Chip Stock

USA . 8,090 parts In-Stock

1+ parts

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8,090

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Vyrian

USA . 4,784 parts In-Stock

1+ parts

-

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4,784

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-

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NAC Semi

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$14.380

1k+ parts

-

10k+ parts

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23

-

$14.380

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$2.164

100+ parts

$201.005

1k+ parts

$1.948

10k+ parts

-

1,887

$2.164

$201.005

$1.948

-

DigiPath Technology Company

USA . 1,558 parts In-Stock

1+ parts

$2.383

100+ parts

$2.193

1k+ parts

-

10k+ parts

-

1,558

$2.383

$2.193

-

-

IDEA Electronic Components Group

UK . 1,231 parts In-Stock

1+ parts

$2.432

100+ parts

-

1k+ parts

$2.189

10k+ parts

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1,231

$2.432

-

$2.189

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ChromeModa Solutions

Germany . 597 parts In-Stock

1+ parts

$2.432

100+ parts

$1.994

1k+ parts

-

10k+ parts

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597

$2.432

$1.994

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-

Corphita

USA . 1,959 parts In-Stock

1+ parts

$5.844

100+ parts

-

1k+ parts

-

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1,959

$5.844

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-

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Lixinc

USA . 13,192 parts In-Stock

1+ parts

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100+ parts

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13,192

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QUARKTWIN TECHNOLOGY LTD

USA . 8,676 parts In-Stock

1+ parts

-

100+ parts

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8,676

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Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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-

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

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100+ parts

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500

-

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GreenTree Electronics

Israel . 118 parts In-Stock

1+ parts

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118

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Overview

Unlock the potential of your consumer electronics with the SN65DP159RSBT by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This versatile IC offers unmatched value, providing seamless performance and reliability. Enhance your product's functionality with the SN65DP159RSBT and experience the benefits of superior engineering and innovation. Elevate your design with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on circuit boards, reducing assembly time and costs.

Package Shape: SQUARE

The square package shape provides efficient use of space on the circuit board, making it ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in demanding industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for efficient connection and stable performance in the circuit system.

Width: 5 mm

The compact width of the product enables it to be used in space-constrained designs without compromising functionality.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage requirement makes the product energy-efficient and suitable for low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand manufacturing processes without damage.

No. of Channels: 4

Having 4 channels allows the product to handle multiple inputs or outputs simultaneously, increasing its versatility.

Technical Specifications

Other Function Consumer ICs SN65DP159RSBT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

SN65DP159RSBT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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