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SN65C3232EDBRG4

Texas Instruments

SN65C3232EDBRG4 by Texas Instruments

SN65C3232EDBRG4 by Texas Instruments is a line driver and receiver with a max supply voltage of 3.6V. It has a small outline package style and is suitable for industrial temperature grade applications. Its interface standard is EIA-232, making it ideal for communication purposes.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 13,950 parts In-Stock

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13,950

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Vyrian

USA . 4,704 parts In-Stock

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4,704

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Digiode

USA . 3,474 parts In-Stock

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3,474

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

$7.313

100+ parts

-

1k+ parts

$7.806

10k+ parts

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1,720

$7.313

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$7.806

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DigiPath Technology Company

USA . 536 parts In-Stock

1+ parts

$8.053

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-

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536

$8.053

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IDEA Electronic Components Group

UK . 584 parts In-Stock

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$8.217

100+ parts

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$7.395

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584

$8.217

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$7.395

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ChromeModa Solutions

Germany . 550 parts In-Stock

1+ parts

$8.217

100+ parts

$6.738

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550

$8.217

$6.738

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Semicontronic

India . 1,187 parts In-Stock

1+ parts

$9.500

100+ parts

$9.262

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$9.215

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1,187

$9.500

$9.262

$9.215

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Corohmni

South Africa . 273 parts In-Stock

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$13.953

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273

$13.953

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AZTECH Wire

Italy . 380 parts In-Stock

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$16.192

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380

$16.192

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Ampacity Inc.

Singapore . 759 parts In-Stock

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$37.500

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759

$37.500

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One Stop Electronics

USA . 1,171 parts In-Stock

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$39.500

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$39.500

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Microchip USA

USA . 12,268 parts In-Stock

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Corphita

USA . 4,931 parts In-Stock

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Argo Parts USA

USA . 4,870 parts In-Stock

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Continental Prestige Electronics

USA . 4,344 parts In-Stock

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4,344

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience high-quality performance and reliability with the SN65C3232EDBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted this line driver and receiver to meet your needs. Whether it's for industrial applications or everyday use, this product offers unmatched value and benefits. With its compact design and wide temperature range, it is suitable for a variety of environments. Trust in Texas Instruments and elevate your communication capabilities with the SN65C3232EDBRG4.

Feature Benefit Bullets

Maximum Supply Voltage

Allows for compatibility with a wide range of systems and devices.

No. of Functions

Provides multiple functions in a single component, reducing the need for additional components.

Maximum Transmit Delay

Ensures fast transmission of data, making the product suitable for high-speed applications.

Power Supplies (V)

Supports both 3.3V and 5V power supplies, providing flexibility in system design.

Maximum High Level Input Current

Low input current helps in reducing power consumption and heat generation.

Output Polarity

Inverted output polarity may be useful in certain applications where this specific feature is required.

Temperature Grade

Industrial grade temperature range allows the product to operate in harsh environments.

Interface Standard

Compliance with EIA-232 standard ensures compatibility with common communication protocols.

Technical Specifications

Line Drivers & Receivers SN65C3232EDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

300 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

300 ns

Width:

5.3 mm

Trade Compliance

SN65C3232EDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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