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SN65C3221DBRE4

Texas Instruments

SN65C3221DBRE4 by Texas Instruments

SN65C3221DBRE4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It features a CMOS technology, EIA-232 interface standard, and inverted output polarity. Ideal for industrial applications requiring a small outline package with Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,289 parts In-Stock

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Digiode

USA . 2,533 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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AZTECH Wire

Italy . 714 parts In-Stock

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$8.350

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714

$8.350

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Corohmni

South Africa . 104 parts In-Stock

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$11.134

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104

$11.134

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Parana Technologies

USA . 379 parts In-Stock

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$12.972

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$13.464

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379

$12.972

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$13.464

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DigiPath Technology Company

USA . 1,768 parts In-Stock

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$14.284

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$13.141

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$14.284

$13.141

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ChromeModa Solutions

Germany . 6,980 parts In-Stock

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$14.575

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$11.952

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$14.575

$11.952

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IDEA Electronic Components Group

UK . 80 parts In-Stock

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$14.575

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$13.846

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$13.118

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80

$14.575

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$13.118

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Ampacity Inc.

Singapore . 934 parts In-Stock

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$30.500

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$30.500

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One Stop Electronics

USA . 1,053 parts In-Stock

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$42.500

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Continental Prestige Electronics

USA . 2,273 parts In-Stock

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Corphita

USA . 1,882 parts In-Stock

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Microchip USA

USA . 1,117 parts In-Stock

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Argo Parts USA

USA . 967 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Experience seamless data transmission with the SN65C3221DBRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Line Drivers & Receivers that provide reliable performance in a wide range of applications. From industrial to consumer electronics, this product offers exceptional value with its high efficiency and durability. Trust Texas Instruments to meet your connectivity needs with the SN65C3221DBRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for long term use.

Surface Mount: YES

Ease of installation and compatibility with modern electronic circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and range.

Package Shape: RECTANGULAR

Efficient use of space and easy integration into existing setups.

Power Supplies (V): 3.3/5

Compatibility with multiple power supply options for convenience.

Technology: CMOS

Ensures low power consumption and reliable performance.

Interface Standard: EIA-232

Compatibility with industry standards for seamless integration in various systems.

Technical Specifications

Line Drivers & Receivers SN65C3221DBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH A 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN65C3221DBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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