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SN54S85J

Texas Instruments

SN54S85J by Texas Instruments

SN54S85J by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 18 ns at 5V. It features a max operating temperature of 125°C and is ideal for military-grade applications requiring fast signal processing in a compact IN-LINE package.

Median Price

$13.630

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Rochester

USA . 1 parts In-Stock

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$13.630

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$13.360

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$13.080

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Digiode

USA . 2,296 parts In-Stock

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$18.563

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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ECAB

Sweden . 136 parts In-Stock

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LWI Electronics Inc

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Holdelec - ElecDif-Pro

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A&K Electronics

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Bristol Electronics

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Rotakorn

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GES GmbH

Germany . 20 parts In-Stock

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Ashlea Components Ltd

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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MISTER SPROCKETS

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Electronic Expediters

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Resion

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AZTECH Wire

Italy . 464 parts In-Stock

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$8.930

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Andel Nordic

Denmark . 143 parts In-Stock

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$11.487

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$11.028

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Parana Technologies

USA . 2,233 parts In-Stock

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$15.460

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$15.841

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DigiPath Technology Company

USA . 779 parts In-Stock

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$17.024

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$15.662

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Component Stockers USA

USA . 19 parts In-Stock

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$17.260

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ChromeModa Solutions

Germany . 2,771 parts In-Stock

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

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$16.502

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$15.634

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Corphita

USA . 2,259 parts In-Stock

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Microchip USA

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Perfect Parts

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Assy Fe

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Kepictronics

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Overview

Enhance your digital arithmetic circuits with the high-quality SN54S85J from Texas Instruments. Designed to provide reliable performance, this product offers a seamless integration into various applications, ensuring precision and efficiency. With a reputation for excellence in manufacturing electronic components, Texas Instruments delivers unmatched value, benefits, and advantages to customers. Elevate your projects with the SN54S85J and experience the superior quality and reliability that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provide durability and reliability to the product, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 18 ns

Low propagation delay ensures fast signal processing, making this product ideal for applications requiring quick response times.

No. of Bits: 4

Suitable for applications that require processing data with a 4-bit resolution.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with most systems and easy to integrate.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Technical Specifications

Digital Arithmetic Circuits SN54S85J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

S

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

115 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54S85J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-077-0657, 5962010770657

NIIN

010770657

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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