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SN54LS325J

Texas Instruments

SN54LS325J by Texas Instruments

Texas Instruments SN54LS325J is a TTL technology oscillator with 16 terminals, operating at 5V. It has a ceramic package body and operates b/w -55°C to 125°C. Ideal for applications requiring precise timing functions in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,317 parts In-Stock

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5,317

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Digiode

USA . 4,128 parts In-Stock

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4,128

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Bristol Electronics

USA . 27 parts In-Stock

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27

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Atlantic Semiconductor

USA . 27 parts In-Stock

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 180 parts In-Stock

1+ parts

$2.898

100+ parts

-

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$3.392

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180

$2.898

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$3.392

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DigiPath Technology Company

USA . 269 parts In-Stock

1+ parts

$3.191

100+ parts

$2.936

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269

$3.191

$2.936

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ChromeModa Solutions

Germany . 6,257 parts In-Stock

1+ parts

$3.256

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$2.670

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6,257

$3.256

$2.670

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IDEA Electronic Components Group

UK . 347 parts In-Stock

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$3.256

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$2.930

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347

$3.256

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$2.930

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One Stop Electronics

USA . 1,221 parts In-Stock

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$4.010

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$4.010

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AZTECH Wire

Italy . 796 parts In-Stock

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$10.978

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796

$10.978

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Corphita

USA . 1,264 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Upgrade your electronic projects with the SN54LS325J by Texas Instruments, a top-quality Other Function Oscillator that delivers reliable performance and precision. With its ceramic package body material and TTL technology, this oscillator ensures stability and durability in any application. From communications to industrial automation, this versatile component offers consistent output at a nominal supply voltage of 5V. Trust Texas Instruments for exceptional quality and innovation, and experience the unmatched value and benefits of the SN54LS325J in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and heat dissipation, making this product durable and reliable in high-temperature environments.

Technology: TTL

TTL technology offers high-speed performance and low power consumption, making this product suitable for applications requiring fast and efficient signal processing.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes this product compatible with most electronic systems and ensures easy integration into existing setups.

No. of Terminals: 16

With 16 terminals, this oscillator provides flexibility for connecting to other components and peripherals, enabling versatile circuit design options.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and maintain stable performance under stress.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable operation in cold environments, making this oscillator suitable for a wide range of applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and provides secure connections, enhancing the overall durability and stability of this product in various setups.

Technical Specifications

Other Function Oscillators SN54LS325J attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Equivalence Code:

DIP16,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Trade Compliance

SN54LS325J Oscillators trade compliance attributes, and parameters.

NSN

5962-14-478-7784, 5962144787784

NIIN

144787784

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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