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SN54LS124J

Texas Instruments

SN54LS124J by Texas Instruments

SN54LS124J by Texas Instruments is a TTL technology oscillator with 16 terminals and 5V supply voltage. Operating b/w -55°C to 125°C, it features a ceramic package body material. Ideal for applications requiring precise timing functions in various electronic circuits.

Median Price

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Lifecycle Status

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7

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1k+

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Vyrian

USA . 3,311 parts In-Stock

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Digiode

USA . 1,760 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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ECAB

Sweden . 72 parts In-Stock

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Electronic Expediters

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Holdelec - ElecDif-Pro

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Ampacity Inc.

Singapore . 798 parts In-Stock

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Semicontronic

India . 1,553 parts In-Stock

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$0.985

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$0.980

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Parana Technologies

USA . 521 parts In-Stock

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$2.285

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$2.784

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DigiPath Technology Company

USA . 462 parts In-Stock

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$2.516

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$2.314

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ChromeModa Solutions

Germany . 988 parts In-Stock

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IDEA Electronic Components Group

UK . 420 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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One Stop Electronics

USA . 617 parts In-Stock

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AZTECH Wire

Italy . 404 parts In-Stock

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Corphita

USA . 2,409 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Assy Fe

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Overview

Unlock endless possibilities with the SN54LS124J by Texas Instruments, a high-quality Other Function Oscillator that guarantees reliable performance. Designed with precision and innovation, Texas Instruments delivers unparalleled value to customers seeking superior electronic components. With its TTL technology and ceramic package body material, this product ensures optimal functionality in a wide range of applications. Trust Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, making this product suitable for high temperature applications.

Technology: TTL

TTL technology offers fast switching speeds and is compatible with a wide range of digital logic circuits, making this oscillator reliable for various applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage ensures compatibility with most electronic systems and simplifies integration into existing setups.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling this oscillator to interface with a variety of external components or circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this oscillator is suitable for use in demanding environments where temperature tolerance is crucial.

Minimum Operating Temperature: -55 °C

The wide temperature range from -55°C to 125°C ensures that this oscillator is suitable for both extreme cold and hot conditions, providing reliability in diverse settings.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish offers good solderability and corrosion resistance, ensuring robust and secure connections during installation and operation.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides easy and secure installation onto printed circuit boards, enabling stable and reliable connections for the oscillator.

Technical Specifications

Other Function Oscillators SN54LS124J attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Equivalence Code:

DIP16,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Terminal Finish:

Tin/Lead (Sn/Pb)

Trade Compliance

SN54LS124J Oscillators trade compliance attributes, and parameters.

NSN

5962-01-092-3870, 5962010923870

NIIN

010923870

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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