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SN54HC221FK

Texas Instruments

SN54HC221FK by Texas Instruments

Texas Instruments SN54HC221FK is a CMOS prescaler with 20 terminals in a square chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It has a power supply range of 2-6V and is surface-mountable, making it ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,083 parts In-Stock

1+ parts

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6,083

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Digiode

USA . 4,111 parts In-Stock

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4,111

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$12.663

100+ parts

-

1k+ parts

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337

$12.663

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One Stop Electronics

USA . 1,632 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,632

$14.000

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Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$23.681

100+ parts

$2,199.151

1k+ parts

$21.313

10k+ parts

-

1,586

$23.681

$2,199.151

$21.313

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DigiPath Technology Company

USA . 1,532 parts In-Stock

1+ parts

$26.076

100+ parts

$23.990

1k+ parts

-

10k+ parts

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1,532

$26.076

$23.990

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ChromeModa Solutions

Germany . 2,563 parts In-Stock

1+ parts

$26.608

100+ parts

$21.819

1k+ parts

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2,563

$26.608

$21.819

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$26.608

100+ parts

$25.278

1k+ parts

$23.947

10k+ parts

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188

$26.608

$25.278

$23.947

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Corphita

USA . 2,336 parts In-Stock

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2,336

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Overview

Upgrade your electronic designs with the SN54HC221FK by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable products that meet the demands of modern technology. This prescaler and multivibrator is versatile and efficient, making it ideal for a wide range of applications. From consumer electronics to industrial equipment, this chip carrier package offers superior performance and durability. Experience the value and benefits of Texas Instruments with the SN54HC221FK.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and insulation, enhancing the overall reliability and performance of the product.

Surface Mount: YES

The surface mount design allows for easy and secure installation onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square packages are known for efficient use of space and ease of handling, making the product suitable for compact electronic devices.

Power Supplies (V): 2/6

Support for a wide range of power supply voltages makes this product versatile and compatible with various types of applications.

No. of Terminals: 20

Having multiple terminals allows for more connectivity options and potential for complex circuit configurations, increasing the product's functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer better protection for the integrated circuit, reducing the risk of damage during handling and operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in harsh environmental conditions, increasing the product's reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for consistent operation in cold environments, making the product suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal positioning provides efficient routing of connections and simplifies circuit layout, contributing to ease of integration into electronic systems.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in demanding environments such as aerospace, defense, and industrial applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, enhancing the efficiency and stability of the product.

Terminal Form: NO LEAD

Lead-free terminal form reduces environmental impact and health risks, aligning with modern industry standards and regulations.

Terminal Pitch: 1.27 mm

Having a standard terminal pitch allows for compatibility with a wide range of PCB layouts and simplifies the assembly process, making the product user-friendly.

Technical Specifications

Prescaler & Multivibrators SN54HC221FK attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54HC221FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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