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5962-9861601QFX

Texas Instruments

5962-9861601QFX by Texas Instruments

The Texas Instruments 5962-9861601QFX is a CMOS Prescaler & Multivibrator with 2 functions, 16 terminals, and a propagation delay of 14 ns. It operates in military-grade temperature range (-55 to 125°C) and has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring precise timing and signal processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,703 parts In-Stock

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7,703

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Digiode

USA . 814 parts In-Stock

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814

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,228 parts In-Stock

1+ parts

$2.743

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1,228

$2.743

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AZTECH Wire

Italy . 235 parts In-Stock

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$19.823

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235

$19.823

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Parana Technologies

USA . 1,715 parts In-Stock

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$28.619

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$49.642

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1,715

$28.619

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$49.642

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DigiPath Technology Company

USA . 1,158 parts In-Stock

1+ parts

$31.513

100+ parts

$28.992

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1,158

$31.513

$28.992

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ChromeModa Solutions

Germany . 5,842 parts In-Stock

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$32.156

100+ parts

$26.368

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$32.156

$26.368

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IDEA Electronic Components Group

UK . 144 parts In-Stock

1+ parts

$32.156

100+ parts

$30.548

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$28.940

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144

$32.156

$30.548

$28.940

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One Stop Electronics

USA . 1,389 parts In-Stock

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$62.000

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$62.000

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Corphita

USA . 4,174 parts In-Stock

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Native Components

USA . 110 parts In-Stock

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$2.419

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$2.419

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Overview

Unlock the power of precision with the 5962-9861601QFX by Texas Instruments. Crafted with expertise and innovation, this Prescaler & Multivibrator boasts unrivaled quality and reliability. Ideal for military-grade applications, its advanced technology and superior performance ensure optimal functionality in any environment. Experience seamless operation and unmatched efficiency with this versatile component. Elevate your projects to new heights with the trusted name in electronics - Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement ensures compatibility with common power sources.

Propagation Delay (tpd): 14 ns

Fast signal processing capability, ideal for applications requiring quick response times.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, suitable for military and industrial applications.

Technology: CMOS

Low power consumption and high noise immunity, ensuring efficient operation.

Technical Specifications

Prescaler & Multivibrators 5962-9861601QFX attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

14 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

5962-9861601QFX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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