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SN54HC191TDE2

Texas Instruments

SN54HC191TDE2 by Texas Instruments

SN54HC191TDE2 by Texas Instruments is a 4-bit digital counter with a propagation delay of 58ns and max frequency of 14MHz. It operates on CMOS technology, has bidirectional count direction, and synchronous operation mode. Ideal for applications requiring fast counting and synchronization in circuits with load capacitance up to 50pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,872 parts In-Stock

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Digiode

USA . 2,349 parts In-Stock

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2,349

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Distributors (Availability)

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AZTECH Wire

Italy . 584 parts In-Stock

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$15.832

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584

$15.832

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Parana Technologies

USA . 989 parts In-Stock

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$21.646

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$22.060

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989

$21.646

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DigiPath Technology Company

USA . 504 parts In-Stock

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$23.835

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504

$23.835

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ChromeModa Solutions

Germany . 5,137 parts In-Stock

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$24.321

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$19.943

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5,137

$24.321

$19.943

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IDEA Electronic Components Group

UK . 106 parts In-Stock

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$24.321

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$23.105

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$21.889

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106

$24.321

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$21.889

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One Stop Electronics

USA . 1,313 parts In-Stock

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$33.000

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Microchip USA

USA . 917 parts In-Stock

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$147.640

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$145.070

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$143.790

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$142.500

917

$147.640

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$142.500

Corphita

USA . 1,558 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN54HC191TDE2 digital counter. This high-performance chip offers a fast propagation delay, ensuring efficient operation in a variety of applications. With its compact surface mount package and bidirectional count direction, this product is perfect for use in digital clocks, frequency counters, and other electronic devices. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for accuracy and precision. Unlock the potential of your designs with the SN54HC191TDE2.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 58 ns

With a fast propagation delay, this digital counter can quickly respond to input signals, making it suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronic devices, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor for easier compatibility with other components and circuit layouts.

No. of Bits: 4

Having 4 bits allows for a wide range of counting possibilities and flexibility in digital circuit designs.

Load Capacitance (CL): 50 pF

The low load capacitance helps minimize signal distortion and improve the overall performance of the digital counter.

No. of Terminals: 16

With 16 terminals, this digital counter offers multiple connection points for various input and output options, enhancing versatility.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides a compact and lightweight design, ideal for applications where space and weight are critical factors.

Maximum I (ol): 5.2 Amp

The high maximum output current capability makes this digital counter suitable for driving power-hungry loads or interfacing with other high-current devices.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and accurate counting operation, especially in applications where precise timing is required.

Terminal Position: UPPER

The upper terminal position simplifies the connection layout and makes it easier to interface with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage, this digital counter can operate efficiently even in low-power environments, extending its range of applications.

Maximum Frequency At Nominal Supply: 14000000 Hz

The high maximum frequency capability allows for fast counting operations, making this product suitable for high-speed digital applications.

Technology: CMOS

The CMOS technology used in this digital counter offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process and provides a reliable connection without the risk of lead contamination.

Packing Method: TUBE

The tube packing method ensures safe transportation and storage of the digital counters, reducing the risk of damage during handling and shipping.

Operation Mode: SYNCHRONOUS

The synchronous operation mode enables accurate synchronization with external clock signals, ensuring precise counting and data integrity.

Count Direction: BIDIRECTIONAL

The bidirectional count direction allows the digital counter to increment and decrement, providing flexibility in counting tasks and sequence control.

Maximum Supply Voltage (Vsup): 6 V

With a high maximum supply voltage, this digital counter can tolerate voltage fluctuations and operate reliably in varying power supply conditions.

Maximum Power Supply Current (ICC): 0.08 mA

The low maximum power supply current ensures efficient power consumption, making this digital counter suitable for battery-powered and energy-efficient applications.

Technical Specifications

Digital Counters SN54HC191TDE2 attributes and parameters. Explore more Digital Counters devices from Texas Instruments

Specs

Count Direction:

BIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-XUUC-N16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

14000000 Hz

Maximum I (ol):

5.2 Amp

Operation Mode:

SYNCHRONOUS

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

58 ns

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Trade Compliance

SN54HC191TDE2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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