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SM72240MFE-3.08/NOPB

Texas Instruments

SM72240MFE-3.08/NOPB by Texas Instruments

SM72240MFE-3.08/NOPB by Texas Instruments is a Power Management IC with 5 terminals, Vsup range of 1V to 5.5V, and +3.08V nominal threshold voltage. It is designed for automotive applications, featuring a small outline package style and operating temperature range from -40°C to 125°C.

Median Price

$4.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 200 parts In-Stock

1+ parts

$4.130

100+ parts

$2.599

1k+ parts

$2.348

10k+ parts

$2.254

200

$4.130

$2.599

$2.348

$2.254

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,929 parts In-Stock

1+ parts

$3.182

100+ parts

-

1k+ parts

-

10k+ parts

-

2,929

$3.182

-

-

-

Vyrian

USA . 1,393 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,393

$3.350

-

-

-

Anansix

USA . 1,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$1.343

100+ parts

$1.222

1k+ parts

$1.101

10k+ parts

-

60

$1.343

$1.222

$1.101

-

Corphita

USA . 721 parts In-Stock

1+ parts

$3.015

100+ parts

-

1k+ parts

-

10k+ parts

-

721

$3.015

-

-

-

Component Stockers USA

USA . 240 parts In-Stock

1+ parts

$3.390

100+ parts

$2.490

1k+ parts

-

10k+ parts

-

240

$3.390

$2.490

-

-

Parana Technologies

USA . 1,672 parts In-Stock

1+ parts

$10.555

100+ parts

-

1k+ parts

$11.057

10k+ parts

-

1,672

$10.555

-

$11.057

-

DigiPath Technology Company

USA . 1,917 parts In-Stock

1+ parts

$11.622

100+ parts

$10.692

1k+ parts

-

10k+ parts

-

1,917

$11.622

$10.692

-

-

ChromeModa Solutions

Germany . 4,637 parts In-Stock

1+ parts

$11.859

100+ parts

$9.724

1k+ parts

-

10k+ parts

-

4,637

$11.859

$9.724

-

-

IDEA Electronic Components Group

UK . 799 parts In-Stock

1+ parts

$11.859

100+ parts

$11.266

1k+ parts

$10.673

10k+ parts

-

799

$11.859

$11.266

$10.673

-

Microchip USA

USA . 1,308 parts In-Stock

1+ parts

$15.890

100+ parts

$15.790

1k+ parts

$15.740

10k+ parts

$15.690

1,308

$15.890

$15.790

$15.740

$15.690

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,000

-

-

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Kepictronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

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150

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Overview

Enhance your power management solutions with the SM72240MFE-3.08/NOPB by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch Power Management ICs that are ideal for a wide range of applications. This small outline, low profile package offers customers the value of precise power supply support circuitry in automotive-grade conditions. With a nominal threshold voltage of +3.08V and a maximum operating temperature of 125°C, this IC ensures optimal performance in any environment. Upgrade your power management systems today with Texas Instruments' SM72240MFE-3.08/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

The surface-mount feature makes it easier to integrate this IC into circuit boards, saving space and streamlining the assembly process.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V is suitable for a wide range of applications, making this IC versatile.

No. of Terminals: 5

Having 5 terminals allows for a simpler and more efficient connection to other components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliability even in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish on the terminals improves solderability and ensures a reliable electrical connection.

Width (mm): 1.6 mm

The compact width of 1.6mm helps in saving space on the circuit board.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this IC meets stringent requirements for reliability and performance in automotive applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs SM72240MFE-3.08/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE VTH= 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

SM72240MFE-3.08/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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