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SHC615AP

Texas Instruments

SHC615AP by Texas Instruments

SHC615AP by Texas Instruments is a Sample & Hold IC with 14 terminals, operating at -40 to 85 °C. It has a supply voltage of +/-5V, max analog input voltage of +/-3V, and uses bipolar technology. Ideal for industrial applications requiring precise sample-and-hold circuitry in compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,008 parts In-Stock

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6,008

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Digiode

USA . 4,802 parts In-Stock

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4,802

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LittleDiode

UK . 3 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 159 parts In-Stock

1+ parts

$4.918

100+ parts

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$5.450

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159

$4.918

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$5.450

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DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$5.415

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$4.982

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56

$5.415

$4.982

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ChromeModa Solutions

Germany . 800 parts In-Stock

1+ parts

$5.526

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$4.531

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800

$5.526

$4.531

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IDEA Electronic Components Group

UK . 737 parts In-Stock

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$5.526

100+ parts

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$4.973

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737

$5.526

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$4.973

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One Stop Electronics

USA . 2,620 parts In-Stock

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$8.410

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$8.410

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AZTECH Wire

Italy . 812 parts In-Stock

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$13.183

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$13.183

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Corphita

USA . 1,788 parts In-Stock

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1,788

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Perfect Parts

USA . 15 parts In-Stock

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Overview

Discover the cutting-edge SHC615AP from Texas Instruments, a leading manufacturer known for superior quality. As part of the Sample & Hold ICs category, this innovative product offers unparalleled value with its precision and reliability. Ideal for industrial applications, the SHC615AP is designed to provide seamless performance even in extreme temperatures. Experience the benefits of this advanced technology and elevate your projects to new heights with Texas Instruments' SHC615AP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in many electronic applications, making this product compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably even in harsh environments or during extended use.

Width: 7.62 mm

The compact width of this product allows for easy integration into tight spaces or densely-packed electronic assemblies.

Technology: BIPOLAR

Bipolar technology ensures accurate and stable performance in signal processing, making this product ideal for precision applications.

Technical Specifications

Sample & Hold ICs SHC615AP attributes and parameters. Explore more Sample & Hold ICs devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Sample and Hold Circuits

Sampling Mode:

Sample and Hold (S&H)

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Supply Voltage:

-6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Analog Input Voltage:

-3 V

Maximum Analog Input Voltage:

3 V

Physical Characteristics

Length:

INCH_MILLIMETER

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style (Meter):

In Line

Trade Compliance

SHC615AP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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