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RI-TMS37126

Texas Instruments

RI-TMS37126 by Texas Instruments

RI-TMS37126 by Texas Instruments is a telecom IC with 30 terminals in a small outline package. It operates b/w -40°C to 85°C, making it suitable for industrial applications. The Gull Wing terminal form and surface mount capability enhance its versatility in telecom interface circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,047 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,047

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Digiode

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$5.785

100+ parts

-

1k+ parts

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10k+ parts

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300

$5.785

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-

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Parana Technologies

USA . 250 parts In-Stock

1+ parts

$11.102

100+ parts

-

1k+ parts

$11.559

10k+ parts

-

250

$11.102

-

$11.559

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$12.225

100+ parts

$11.247

1k+ parts

-

10k+ parts

-

2,257

$12.225

$11.247

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ChromeModa Solutions

Germany . 3,566 parts In-Stock

1+ parts

$12.474

100+ parts

$10.229

1k+ parts

-

10k+ parts

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3,566

$12.474

$10.229

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$12.474

100+ parts

$11.850

1k+ parts

$11.227

10k+ parts

-

2,087

$12.474

$11.850

$11.227

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One Stop Electronics

USA . 1,543 parts In-Stock

1+ parts

$277.000

100+ parts

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10k+ parts

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1,543

$277.000

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Corphita

USA . 2,907 parts In-Stock

1+ parts

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2,907

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Overview

Elevate your telecommunications experience with the RI-TMS37126 by Texas Instruments. Renowned for their superior quality and cutting-edge technology, Texas Instruments has once again delivered a standout product in the Other Function Telecom Interface ICs category. This small outline package boasts 30 terminals and industrial-grade temperature capabilities, making it ideal for a wide range of telecom applications. With seamless surface mount integration and gull wing terminal form, the RI-TMS37126 offers unparalleled value, reliability, and efficiency to our customers. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mount allows for easy integration onto PCBs, saving space and improving overall design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used in telecom applications, making it compatible with existing designs and layouts.

No. of Terminals: 30

The high number of terminals provides a wide range of connectivity options, allowing for versatile use in telecom interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps to reduce overall footprint, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even under demanding operating conditions, preventing overheating and potential damage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments, providing flexibility in deployment locations.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal integrity, enhancing overall performance and reliability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can operate in harsh industrial environments, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs, ensuring a reliable electrical connection for stable performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC offers optimized performance and compatibility for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs RI-TMS37126 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G30

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

RI-TMS37126 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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