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REF3333AIDCKTG4

Texas Instruments

REF3333AIDCKTG4 by Texas Instruments

REF3333AIDCKTG4 by Texas Instruments is a 3-terminal voltage reference with nominal output voltage of 3.3V and max supply voltage of 5.5V. It operates in automotive temperature grade range from -40 to 125 °C, with a max output current of 0.005A. This small outline package is ideal for applications requiring precise voltage references in tight spaces.

Median Price

$1.360

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 499 parts In-Stock

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$1.360

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$1.200

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$1.360

$1.200

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Chip Stock

USA . 14,960 parts In-Stock

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Vyrian

USA . 7,253 parts In-Stock

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Digiode

USA . 246 parts In-Stock

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Nova Conductors

Japan . 42 parts In-Stock

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Ampacity Inc.

Singapore . 77 parts In-Stock

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$1.160

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Corohmni

South Africa . 198 parts In-Stock

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$1.830

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Semicontronic

India . 355 parts In-Stock

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$2.520

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$2.457

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$2.444

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$2.520

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Parana Technologies

USA . 728 parts In-Stock

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$2.575

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$3.065

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DigiPath Technology Company

USA . 453 parts In-Stock

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$2.835

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ChromeModa Solutions

Germany . 5,644 parts In-Stock

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$2.893

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$2.372

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IDEA Electronic Components Group

UK . 683 parts In-Stock

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$2.893

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AZTECH Wire

Italy . 220 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,811 parts In-Stock

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Continental Prestige Electronics

USA . 5,437 parts In-Stock

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Microchip USA

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Argo Parts USA

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Corphita

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Aranea Global

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Perfect Parts

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Overview

Discover the REF3333AIDCKTG4 by Texas Instruments, a top-quality voltage reference ideal for a wide range of applications. With a compact design and high reliability, this three-terminal voltage reference offers precise output voltage of 3.3V and maximum voltage tolerance of 0.15%. Whether you're in the automotive industry or working on electronic devices, this product ensures stable performance in extreme temperatures from -40°C to 125°C. Trust Texas Instruments for cutting-edge technology and superior products that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V provides stable and consistent power to the voltage reference, ensuring accurate performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme temperature conditions, making it suitable for industrial and automotive applications.

Maximum Output Current: 0.005 A

The maximum output current of 0.005A allows the product to deliver sufficient current while maintaining stability and accuracy in voltage output.

Technical Specifications

Voltage References REF3333AIDCKTG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.005 A

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-323

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Max Voltage Temp Coef:

30 ppm/Cel

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.15 %

Width (mm):

1.25 mm

Trade Compliance

REF3333AIDCKTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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