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REF3225AMDBVREP

Texas Instruments

REF3225AMDBVREP by Texas Instruments

REF3225AMDBVREP by Texas Instruments is a voltage reference with 2.495-2.505 V output range, ideal for military applications. It operates b/w -55 to 125 °C and has a supply current of 0.12 mA, making it suitable for low-power CMOS designs in compact spaces. With a small outline package style and surface mount capability, it offers precise voltage regulation in tight layouts.

Median Price

$10.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$10.330

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$10.330

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Vyrian

USA . 6,005 parts In-Stock

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Digiode

USA . 1,506 parts In-Stock

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QIE Inc.

USA . 134 parts In-Stock

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134

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One Stop Electronics

USA . 766 parts In-Stock

1+ parts

$0.500

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766

$0.500

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Ampacity Inc.

Singapore . 652 parts In-Stock

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$5.500

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652

$5.500

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AZTECH Wire

Italy . 450 parts In-Stock

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$9.820

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$9.820

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Continental Prestige Electronics

USA . 6,321 parts In-Stock

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$10.330

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$10.123

6,321

$10.330

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$10.123

Netroflash

USA . 100 parts In-Stock

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$10.330

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$9.813

10k+ parts

$9.607

100

$10.330

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$9.813

$9.607

Microchip USA

USA . 422 parts In-Stock

1+ parts

$17.510

100+ parts

$17.260

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$17.130

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$17.010

422

$17.510

$17.260

$17.130

$17.010

Parana Technologies

USA . 352 parts In-Stock

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$21.700

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$22.132

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$21.700

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ChromeModa Solutions

Germany . 6,344 parts In-Stock

1+ parts

$24.382

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$19.993

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$24.382

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IDEA Electronic Components Group

UK . 1,024 parts In-Stock

1+ parts

$24.382

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$23.163

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$21.944

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Lixinc

USA . 19,035 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,980 parts In-Stock

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Corphita

USA . 3,438 parts In-Stock

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Kepictronics

USA . 3,250 parts In-Stock

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DigiPath Technology Company

USA . 427 parts In-Stock

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$21.983

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427

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Argo Parts USA

USA . 328 parts In-Stock

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Overview

Experience the precision and reliability of Texas Instruments with the REF3225AMDBVREP voltage reference. Designed with quality and performance in mind, this small outline, low profile package offers a stable output voltage of 2.5V for a wide range of applications. With a military-grade temperature range and excellent voltage tolerance, this voltage reference ensures accurate and consistent performance in any environment. Trust Texas Instruments for top-notch products that deliver value and peace of mind to customers in need of reliable voltage references.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this voltage reference lightweight and durable.

Surface Mount: YES

This voltage reference can be easily mounted on a circuit board, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement on a PCB and efficient use of space.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes this voltage reference compatible with a wide range of applications.

No. of Terminals: 6

Having 6 terminals provides flexibility for connecting to various circuits and components.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile design with shrink pitch allows for compact and space-saving integration into electronic devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this voltage reference can withstand high temperature environments.

Minimum Output Voltage: 2.495 V

The minimum output voltage of 2.495V ensures stable and accurate reference voltage for precision applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this voltage reference can function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

Maximum Output Voltage: 2.505 V

The maximum output voltage of 2.505V ensures a tight voltage range for consistent and precise reference voltage output.

Terminal Position: DUAL

The dual terminal position offers versatility in circuit connections and layout options.

Maximum Seated Height: 1.45 mm

The low seated height of 1.45mm allows for slim and compact designs in electronic applications.

Width (mm): 1.6 mm

The narrow width of 1.6mm enables placement in tight spaces and densely populated PCBs.

Other IC type: THREE TERMINAL VOLTAGE REFERENCE

Being a three-terminal voltage reference simplifies circuit integration and ensures accurate voltage regulation.

Minimum Supply Voltage (Vsup): 2.55 V

The minimum supply voltage requirement of 2.55V allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this voltage reference is easy to solder onto a PCB.

Peak Reflow Temperature °C: 260

This voltage reference can withstand a peak reflow temperature of 260°C during assembly processes.

Length: 2.9 mm

The compact length of 2.9mm contributes to space-efficient design layouts in electronic circuits.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable performance under extreme temperature conditions.

Maximum Supply Current (Isup): 0.12 mA

With a maximum supply current of 0.12mA, this voltage reference operates efficiently and conserves power.

Maximum Output Current: 0.01 A

The maximum output current of 0.01A allows for driving external circuitry with adequate current capacity.

Technology: CMOS

The CMOS technology used in this voltage reference offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and ensures robust mechanical connections to the PCB.

Maximum Voltage Tolerance: 0.2 %

The tight maximum voltage tolerance of 0.2% ensures accurate and stable reference voltage output.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm enables close spacing of terminals for compact PCB designs.

Max Voltage Temp Coef: 40 ppm/°C

With a maximum voltage temperature coefficient of 40 ppm/°C, this voltage reference maintains stability over a wide temperature range.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the level of protection against moisture exposure during storage and handling.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures safe operation and protection against overvoltage conditions.

Nominal Output Voltage: 2.5 V

The nominal output voltage of 2.5V provides a stable and reliable reference voltage for precise circuit operation.

Technical Specifications

Voltage References REF3225AMDBVREP attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.01 A

Maximum Output Voltage:

2.505 V

Minimum Output Voltage:

2.495 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Voltage References

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.55 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Max Voltage Temp Coef:

40 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.2 %

Width (mm):

1.6 mm

Trade Compliance

REF3225AMDBVREP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-644-8590, 5962016448590

NIIN

016448590

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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