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PTHVD1426DR

Texas Instruments

PTHVD1426DR by Texas Instruments

PTHVD1426DR by Texas Instruments is a line driver & receiver with 8 terminals, operating at 3-5.5V. It offers differential output, EIA-485-A interface standard, and Schmitt trigger input characteristics. Ideal for automotive applications due to its small outline package style and wide temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,478 parts In-Stock

1+ parts

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5,478

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Digiode

USA . 4,042 parts In-Stock

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4,042

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,441 parts In-Stock

1+ parts

$6.112

100+ parts

$567.558

1k+ parts

$5.500

10k+ parts

-

1,441

$6.112

$567.558

$5.500

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DigiPath Technology Company

USA . 1,139 parts In-Stock

1+ parts

$6.730

100+ parts

$6.191

1k+ parts

-

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1,139

$6.730

$6.191

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ChromeModa Solutions

Germany . 5,909 parts In-Stock

1+ parts

$6.867

100+ parts

$5.631

1k+ parts

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5,909

$6.867

$5.631

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$6.867

100+ parts

-

1k+ parts

$6.180

10k+ parts

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1,047

$6.867

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$6.180

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One Stop Electronics

USA . 1,257 parts In-Stock

1+ parts

$10.500

100+ parts

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1,257

$10.500

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AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$12.458

100+ parts

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777

$12.458

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Corphita

USA . 1,889 parts In-Stock

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1,889

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Overview

Elevate your electronic designs with the Texas Instruments PTHVD1426DR line driver and receiver. Crafted with precision by a trusted manufacturer, this product offers unrivaled quality and reliability. Ideal for various applications in the automotive industry and beyond, its differential output ensures efficient signal transmission. With a compact design and a wide operating temperature range, this product delivers exceptional value and performance. Upgrade your projects today with the PTHVD1426DR and experience the benefits of top-notch engineering at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltages, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Compact and space-saving design that can fit easily in electronic devices.

Maximum Transmit Delay: 35 ns

Provides fast signal transmission, ensuring efficient performance.

No. of Terminals: 8

Offers multiple connection points for compatibility with various systems.

Package Style (Meter): SMALL OUTLINE

Sleek and modern design that enhances the overall look of the product.

Minimum Supply Voltage: 3 V

Works efficiently even at lower voltages, saving energy and reducing costs.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Output Characteristics: DIFFERENTIAL

Provides better noise immunity and signal integrity compared to single-ended outputs.

Minimum Operating Temperature: -40 °C

Operates effectively in harsh environments with low temperatures.

Terminal Position: DUAL

Offers flexibility in wiring and connections for versatile usage.

Maximum Seated Height: 1.75 mm

Low profile design that can fit in compact spaces.

Width: 3.895 mm

Compact size that can easily be accommodated on circuit boards.

Output Polarity: COMPLEMENTARY

Delivers balanced signals for improved noise immunity.

Differential Output: YES

Provides better signal quality and noise rejection compared to single-ended outputs.

Length: 4.905 mm

Optimal size for easy integration into electronic systems.

Minimum Out Swing: 1.5 V

Works effectively with lower swing voltages, conserving power.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, ensuring reliability in vehicle applications.

Maximum Receive Delay: 75 ns

Ensures quick reception of signals for efficient communication.

Terminal Form: GULL WING

Easy to solder onto circuit boards, enhancing the assembly process.

Interface Standard: EIA-485-A; TIA-485-A

Complies with industry standards for seamless integration with existing systems.

Maximum Supply Current: 3 mA

Low power consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides noise immunity and hysteresis for reliable signal detection.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for stable and efficient operation.

Terminal Pitch: 1.27 mm

Standard pitch size for easy connection to other components.

Interface IC Type: LINE TRANSCEIVER

Facilitates bidirectional communication between systems for enhanced functionality.

Technical Specifications

Line Drivers & Receivers PTHVD1426DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V NOM

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

Length:

4.905 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Receive Delay:

75 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

35 ns

Width:

3.895 mm

Trade Compliance

PTHVD1426DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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