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PT7681C

Texas Instruments

PT7681C by Texas Instruments

PT7681C by Texas Instruments is a voltage-mode switching regulator with 27 terminals, operating temperature range of -40 to 85°C, and max output current of 30A. It is ideal for industrial applications requiring a hybrid technology switcher with a max switching frequency of 350kHz. The package style is microelectronic assembly in a rectangular shape made of metal, suitable for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,063 parts In-Stock

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6,063

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Digiode

USA . 3,310 parts In-Stock

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3,310

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Distributors (Availability)

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One Stop Electronics

USA . 787 parts In-Stock

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$0.500

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787

$0.500

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Semicontronic

India . 1,423 parts In-Stock

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$1.500

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$1.462

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$1.455

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1,423

$1.500

$1.462

$1.455

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AZTECH Wire

Italy . 275 parts In-Stock

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$16.145

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275

$16.145

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Parana Technologies

USA . 181 parts In-Stock

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$21.167

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$21.452

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181

$21.167

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$21.452

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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$23.307

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$21.443

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1,633

$23.307

$21.443

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ChromeModa Solutions

Germany . 5,153 parts In-Stock

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$23.783

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$19.502

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5,153

$23.783

$19.502

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IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$23.783

100+ parts

$22.594

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$21.405

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374

$23.783

$22.594

$21.405

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Component Stockers USA

USA . 461 parts In-Stock

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$99.990

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461

$99.990

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Corphita

USA . 3,443 parts In-Stock

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3,443

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Unlock the potential of your electronic design with the PT7681C from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality switching regulators and controllers that are essential for various applications. The PT7681C offers unmatched performance, reliability, and efficiency, making it an ideal choice for industrial-grade projects. With a maximum output current of 30 A and a compact package body material, this product ensures seamless integration and optimal functionality. Elevate your electronics with the PT7681C and experience unparalleled value and innovation.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides better heat dissipation, ensuring the regulator stays cool during operation and increasing efficiency.

Surface Mount: YES

Surface mount capability makes it easier to integrate into PCB designs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement on the PCB and efficient use of board space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this regulator is suitable for industrial applications where temperature variations are common.

Nominal Input Voltage: 5 V

Nominal input voltage of 5V is commonly used in many devices, making this regulator compatible with a wide range of applications.

Maximum Output Current: 30 A

High maximum output current of 30A allows the regulator to power multiple devices simultaneously, making it versatile for various scenarios.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies, providing a balance of efficiency, performance, and cost-effectiveness.

Technical Specifications

Switching Regulators & Controllers PT7681C attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-MSMA-G27

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

30 A

Package Body Material:

METAL

Package Equivalence Code:

SMSIP27H,1.4

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

350 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

PT7681C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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